| Allicdata Part #: | ATS-10D-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat-sinks are important components in many applications, and the ATS-10D-40-C1-R0 heat sink is no exception. This thermal-sinking device is designed for low-voltage applications, including computer components, lighting, and power supplies. It is also used in some consumer applications.
The ATS-10D-40-C1-R0 heat sink is made up of two components; a copper base and a fan housing. The copper base helps to dissipate heat from the power supply or other components and the fan housing helps to circulate air. The copper base also improves heat transfer from the component to be cooled and the entire device efficiently dissipates heat with minimal noise.
The device is designed to be integrated into a circuit board. It is designed with two lead slots to provide easy access for soldering. The device also has two recessed screw cavities for mounting to the board. This provides a secure and reliable way to mount the device.
The ATS-10D-40-C1-R0 heat sink is a thermal device that utilizes air cooling technology to dissipate heat from the component or device it is attached to. The copper base helps to transfer heat away from the components, while the fan housing directs air away from the components. The air directed away from the components prevents overheating and maintains stable temperatures, even under heavy-duty operation. This helps to extend the life of the component or device.
In general, the ATS-10D-40-C1-R0 heat sink is a reliable, efficient, and cost-effective thermal device. It can be used for a variety of applications including CPU coolers, power supplies, and consumer applications. The device is easy to install and offers improved performance and reliability over traditional air-cooling methods.
The specific data is subject to PDF, and the above content is for reference