| Allicdata Part #: | ATS-10D-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sinks are an essential solution for efficiently manage heat, thereby ensuring the safety and integrity of sensitive microelectronics components, and the ATS-10D-48-C3-R0 is one such device. It is designed to provide effective thermal transfer and dissipation, while remaining highly reliable.
An ATS-10D-48-C3-R0 is a low-profile, top-tier heat sink designed to provide greater cooling capacity for high-density electronic boards. It utilizes 48 pins as thermal path, and has a base diversity design that offers maximum thermal performance on a wide array of components and substrates. It is highly efficient as it can lower junction temperatures 10°C below ambient temperatures.
The ATS-10D-48-C3-R0 is especially suitable for passive cooling of high-powered components such as CPUs, FPGAs, and others. By using the ATS-10D-48-C3-R0, designers and engineers can significantly reduce their cooling costs by using conduction to dissipate heat from the component and into the air. The ATS-10D-48-C3-R0 can also be used to improve the overall system performance by providing more stability and efficiency due to the reduced thermal gradients.
The ATS-10D-48-C3-R0 is manufactured from high-grade materials that are thermally efficient, environmentally friendly, and durable, ensuring a long-term performance and reliability. The device features a direct-connect thermal transfer plate with an optimized alloy for superior heat transfer that increases the thermal dissipation of the component, effectively managing heat. The device also offers the flexibility to be easily mounted on any surface, including standard boards, effectively making it fit for a wide range of applications.
The ATS-10D-48-C3-R0 is designed to be cost-effective while providing excellent performance. It is robust, reliable, and designed to be multi-surface mountable, allowing it to fit into a variety of applications. It is an optimized combination of thermal performance, weight, power, and cost, making it an ideal solution for cooling high-density electronic boards.
The working principle of the ATS-10D-48-C3-R0 involves efficient thermal transfer and dissipation. Heat from the component is transferred to the direct-connect thermal path plate which is then dissipated into the air using convection or fan cooling. This results in the component\'s temperature being lowered by as much as 10°C. This ensures that the component runs at optimal temperatures, providing improved system performance and reliability, as well as cost savings.
The ATS-10D-48-C3-R0 is an ideal solution for any application that requires effective cooling. Its small size and low profile make it especially suitable for dense electronic boards. Its robust design and durable construction allow it to provide long-term performance, and its efficient thermal transfer maximize its cooling capability. The ATS-10D-48-C3-R0 is an ideal choice for reducing costs, improving efficiency, and prolonging the life of sensitive microelectronic components.
The specific data is subject to PDF, and the above content is for reference