| Allicdata Part #: | ATS-10D-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of effective cooling inside electronic systems. Heat sinks are used in such systems to dissipate heat away from sensitive components. The ATS-10D-50-C1-R0 is a popular heat sink used in many types of electronic systems for thermal management.
The ATS-10D-50-C1-R0 is a lightweight, low profile aluminum heat sink designed for cooling and providing better airflow around components in crowded electronic enclosures. It has a high fin density which provides greater surface area for heat dissipation. The fins are also thin enough to allow the heat sink to fit into tight areas.
The ATS-10D-50-C1-R0 is designed for use in a variety of applications including small fanless systems, audio/video equipment, portable electronics, and military and aerospace electronics. It is particularly useful in applications where space is at a premium. It is also well suited for applications that require a high degree of airflow or require the heat to be dissipated quickly. The heat sink can withstand much higher temperatures than the components it is cooling and is designed to be corrosion resistant.
The working principle of the ATS-10D-50-C1-R0 heat sink is based on the idea of convection. This type of heat sink relies on air movement over the fins to dissipate heat away from the components and into the ambient air. As hot air rises from the component, the fins draw the heat away. The fins also help spread the heat over larger areas so that it is more evenly distributed. This allows for more effective cooling. The ATS-10D-50-C1-R0 also has an added design feature of incorporating a fan to help with airflow and heat dissipation.
The ATS-10D-50-C1-R0 is a versatile heat sink that can be used in many types of electronic systems for thermal management. Its lightweight design makes it well suited for applications where there is limited space and its high fin density provides better heat dissipation. The heat sink is also corrosion resistant and designed to be durable. Its working principle is based on convection and its fan adds additional airflow for improved heat dissipation. The ATS-10D-50-C1-R0 is a great choice for applications which require effective cooling and thermal management.
The specific data is subject to PDF, and the above content is for reference