| Allicdata Part #: | ATS-10D-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used for many different purposes such as heat management, cooling of electronic components, and providing structural support to PCBs. The ATS-10D-65-C1-R0 Heat Sink is designed for industrial applications that require robust thermal solutions. It has been designed to operate in temperatures of up to 180°C in order to provide reliability and stability in temperature-sensitive applications.
The ATS-10D-65-C1-R0 Heat Sink is made with a heavy-duty aluminium body which is extremely durable and corrosion resistant. It is also designed to provide good thermal performance and efficient heat dissipation. The heat sink has a finned design which helps to increase the surface area of the heat sink and allows the thermal energy to be dissipated more efficiently.
The ATS-10D-65-C1-R0 Heat Sink has a simple yet effective design. It is a two-stage heat sink which consists of a base stage and a top stage. The first stage is designed to dissipate heat away from the component and into the air. This stage is usually lined with a thermal gap filler to help dissipate the heat even further. The second stage is then designed to dissipate the remaining heat into the air. The overall effect is a more efficient heat distribution and cooling of the component.
The ATS-10D-65-C1-R0 Heat Sink is suitable for medium to high power applications and can be used in a variety of environments and temperatures. It offers good thermal performance in both cooling and transferring heat away from the component as well as providing reliable operation in extreme temperatures. The heat sink can be used to mount a variety of electronic components such as CPUs, GPUs, and I/O controllers. This makes it an ideal solution for industrial applications and helps to extend the life of the components.
The ATS-10D-65-C1-R0 Heat Sink is designed for easy installation and can be mounted with standard hardware. It is available in a range of sizes and shapes to fit different sized components so that it can be tailored to the specific application. Thanks to its robust design and premium materials, the ATS-10D-65-C1-R0 heat sink is designed to provide reliable and stable performance in the most demanding environments.
The specific data is subject to PDF, and the above content is for reference