| Allicdata Part #: | ATS17691-ND |
| Manufacturer Part#: |
ATS-10E-03-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-03-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential in many electronic components. ATS-10E-03-C2-R0 is a type of heat sink designed specifically for embedded electronic components. It helps to cool the components and prevent them from overheating.
The ATS-10E-03-C2-R0 consists of two parts: the top part is the actual heat sink itself, which is made of copper or aluminium alloy. The bottom part is the base which is made of steel or other materials. The heat sink is designed with a thermal conductive material between the base and the top plate. This material facilitates the heat transfer from the electronic component to the heat sink. The heat is then dissipated into the surrounding environment, which keeps the electronic components from overheating.
The ATS-10E-03-C2-R0 also has fins which are used to increase the surface area and allow for better heat dissipation. This makes the heat sink more efficient and effective in cooling down the electronic components. The fins also help to reduce air turbulence which can reduce the cooling efficiency.
The ATS-10E-03-C2-R0 is designed to be lightweight, low cost and easy to install. It can be mounted on a circuit board or onto a chassis to form an efficient cooling system. It is suitable for use in any embedded application such as computers, televisions, and video game consoles.
In addition, the ATS-10E-03-C2-R0 has a low profile design which helps to reduce the size of the components while still providing efficient cooling. This is especially useful if the components are installed in a confined area or where there are limited space available. The low profile design also helps to reduce the noise generated by the fan and improve the overall cooling efficiency.
The working principle of ATS-10E-03-C2-R0 is simple. The heat from the components is absorbed by the thermal material on the heat sink and is dissipated to the surrounding air. This keeps the components from overheating and helps them to perform better. The size and shape of the fins also helps to increase the surface area, which further increases the cooling efficiency.
In conclusion, the ATS-10E-03-C2-R0 is a great choice for embedded application fields. It is lightweight, low cost, and easy to install. It can also provide the highest level of cooling efficiency with its low profile design and fins that increase the surface area. With its excellent cooling capabilities, the ATS-10E-03-C2-R0 is an ideal thermal heat sink for any embedded application.
The specific data is subject to PDF, and the above content is for reference