
Allicdata Part #: | ATS-10E-05-C1-R0-ND |
Manufacturer Part#: |
ATS-10E-05-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.13866 |
30 +: | $ 3.05361 |
50 +: | $ 2.88401 |
100 +: | $ 2.71435 |
250 +: | $ 2.54470 |
500 +: | $ 2.45987 |
1000 +: | $ 2.20541 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management device designed to absorb and dissipate heat generated by an electronic device; such as a power supply. One of the most common types of heat sinks is the ATS-10E-05-C1-R0. This article will discuss the application fields and working principle of ATS-10E-05-C1-R0 heat sinks.
The ATS-10E-05-C1-R0 heat sink is designed to provide the utmost efficiency in thermal management applications. Its thermal performance is provided by an advanced three-dimensional fin geometry, which drastically improves the surface area. This increases the ability to absorb and disperse heat, allowing for improved cooling and performance.
The ATS-10E-05-C1-R0 heat sink is designed for use in a broad range of applications such as automotive, industrial, medical, networking, automotive, consumer, and many other industrial uses. In automotive applications, these heat sinks can be used for cooling engines, providing a lower profile than traditional radiators. In industrial applications, these heat sinks can be used to dissipate heat from electric motors, compressors, and other mechanical components.
The working principle of ATS-10E-05-C1-R0 heat sinks is simple yet effective. As heat is generated from the electronic device, the heat sink dissipates the heat away from the chip or component. As the device juices are heated, air moves over the device and its fins, absorbing the heat and transferring it away from the device. This air is then released outside the enclosed area, thus creating a safe environment for any components that may be sensitive to heat.
The ATS-10E-05-C1-R0 heat sink also incorporates a multitude of features such as built-in fans, various mounting configurations, and EMI/conductive shielding options. These features give the user unprecedented control over the operation and performance of the heat sink, which in turn gives them the confidence of knowing their electronic device is efficiently cooled.
The ATS-10E-05-C1-R0 heat sink is a critical component in a wide variety of electronic devices due to its efficient thermal management and versatility. It is able to dissipate heat quickly, efficiently, and effectively, ensuring that the device remains cool which in turn provides reliable and safe operation. As such, the ATS-10E-05-C1-R0 is an ideal choice for any application needing effective thermal management.
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