ATS-10E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-10-C3-R0-ND

Manufacturer Part#:

ATS-10E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-10-C3-R0 datasheetATS-10E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are highly versatile integral cooling solutions for electronic devices. In many applications, thermal management plays an important role. The ATS-10E-10-C3-R0 Heat Sink is a compact heat sink designed to meet the needs of applications where there is limited space or where a traditional, larger Heat Sink simply won\'t fit. The ATS-10E-10-C3-R0 Heat Sink is designed to disperse heat away from heat-generating components by conducting it to an area of a larger surface area.

Engineered with a unique combination of aluminum alloy, the ATS-10E-10-C3-R0 heat sink boasts superior thermal performance in applications with limited space due to its compact shape. The innovative vertical fins of the heat sink increase the surface area, providing increased air circulation and improved heat dissipation. The aluminum alloy material also ensures a longer usable lifespan for the heat sink. The total maximum weight of the ATS-10E-10-C3-R0 heat sink is under two kilograms.

When mounted properly, air is drawn across the heat sink which aids in dissipating heat away from the component attached to the heat sink fins. The ATS-10E-10-C3-R0 heat sink is designed to be mounted using a fan on the underside of the component, providing additional cooling capabilities. This combination of a fan and the heat sink ensures effective heat output while also providing additional safety in cases of forced air.

The heat sink design and its materials ensure effective heat dissipation at temperatures up to 135°C. This ensures that the ATS-10E-10-C3-R0 can be used in high-temperature applications. In most cases, the heat sink will be attached to a component via thermal pads or thermal tape applied on the contact points of the component and the heat sink. This ensures a secure and efficient bond between the two components. The ATS-10E-10-C3-R0 heat sink is designed to meet the needs of applications that require thermal design solutions implemented in tight spaces, offering optimal thermal management in any environment.

The ATS-10E-10-C3-R0 Heat Sink is a lightweight, highly effective thermal management solution for a variety of applications. The product offers superior performance in low-space requirements, whereby the heat sink is designed to provide efficient thermal management without using the traditional larger heat sinks. Its combination of aluminum alloy material and vertical fins also ensures prolonged use in high-temperature applications. The heat sink is designed with a unique mounting configuration to ensure maximum efficiency while providing additional safety. This is a versatile thermal solution for many applications, making it an ideal choice for anyone looking for effective thermal management in a small package.

The specific data is subject to PDF, and the above content is for reference

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