| Allicdata Part #: | ATS-10E-103-C3-R1-ND |
| Manufacturer Part#: |
ATS-10E-103-C3-R1 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-103-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used as a part of an efficient cooling system for a variety of applications. The ATS-10E-103-C3-R1 is one such piece of equipment, designed to transfer heat from internal components to the surrounding environment.
This thermoelectric module is made of aluminum, which is lightweight and durable, providing stability even when used in high temperature applications. It features a low thermal resistance value and a thermal spreader on the back side for greater heat transfer capabilities. The design also includes a built-in heat shield for protection from the elements, and it has an LED indicator that alerts users when the heat sink is running properly.
The ATS-10E-103-C3-R1’s primary purpose is to transfer heat away from sensitive electronics and components. In order to do this efficiently, it uses thermoelectric cooling, which leverages the Seebeck effect to generate a cooling or heating effect depending on the orientation of the two semiconductors. This allows for efficient heat transfer and cooling.
Due to its high thermal resistance, excellent heat transfer capabilities, and reliable structure, the ATS-10E-103-C3-R1 is ideal for a wide variety of applications. It can be used to cool CPU and GPU chips, as well as other sensitive electronics that need to operate at an optimal temperature. It is also suitable for medical equipment, scientific instruments, automotive electronics, commercial HVAC systems, and a variety of other applications.
The ATS-10E-103-C3-R1 is a great option for applications that require efficient heat transfer for continued operation. Its aluminum material is lightweight and durable, while its heat shield provides protection from outside elements. Additionally, its thermoelectric cooling capabilities make it suitable for a variety of applications, such as CPU or GPU cooling and medical equipment.
The specific data is subject to PDF, and the above content is for reference