ATS-10E-11-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS17709-ND

Manufacturer Part#:

ATS-10E-11-C2-R0

Price: $ 4.06
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-11-C2-R0 datasheetATS-10E-11-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.68550
10 +: $ 3.58596
25 +: $ 3.38663
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 4.06
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are large metal devices that are used to transfer heat generated by a wide range of devices and applications. They are commonly used in industrial, commercial, and consumer electronics. ATS-10E-11-C2-R0 is a thermal heat sink designed to facilitate efficient heat transfer from an electronic device or component to the environment.

The ATS-10E-11-C2-R0 is a relatively compact heat sink that is characterised by its impressive thermal performance and small footprint. It features a high density fin array which is designed to maximise the heat dissipation rate from the device, helping it to stay cool during operation.

The heat sink is constructed using a low thermal impedance base and a surface mountable design that allows for ease of installation in tight spaces. The base is made of an aluminium substrate which is capable of dissipating heat quickly and effectively, while a nickel-coated copper insert increases heat transfer efficiency by providing a low-resistance contact between the heat source and the base. The fins are made of a specially designed aluminium alloy which maximises air flow and helps to minimise thermal impedance.

In addition to its construction, the ATS-10E-11-C2-R0 also comes with specially designed mounting hardware which allows for quick and easy installation. Moreover, the thermal heat sink comes with a thermal control system which monitors system temperature and helps to prevent overheating.

The ATS-10E-11-C2-R0 is an ideal choice for applications that require efficient heat transfer and cooling. It is suitable for use in a variety of electronics such as computers, gaming systems, and media players. It is also ideal for commercial systems such as LED lighting, air conditioning, and automotive components. Furthermore, the small size and light weight of the heat sink make it a great choice for use in space-constrained places.

The ATS-10E-11-C2-R0 has a number of unique features that makes it suitable for use in a variety of applications. Its advanced thermal design allows it to offer an unparalleled level of performance while still maintaining a low-profile form factor. Additionally, the nickel-plated copper insert ensures maximum heat transfer from the device while keeping temperatures under control.

In summary, the ATS-10E-11-C2-R0 thermal heat sink is an effective and reliable solution for heat dissipation. Its compact size and light weight make it extremely versatile and suitable for a variety of applications. Furthermore, its advanced design ensures optimal thermal performance while still maintaining a low-profile form factor.

The specific data is subject to PDF, and the above content is for reference

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