| Allicdata Part #: | ATS17712-ND |
| Manufacturer Part#: |
ATS-10E-112-C2-R1 |
| Price: | $ 7.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-112-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.30000 |
| 10 +: | $ 6.13053 |
| 25 +: | $ 5.78995 |
| 50 +: | $ 5.44925 |
| 100 +: | $ 5.10867 |
| 250 +: | $ 4.76809 |
| 500 +: | $ 4.42751 |
| 1000 +: | $ 4.34237 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a vital part of any electronics system. In order to keep temperatures within the accepted operating parameters, effective cooling solutions need to be implemented. Heat sinks are one of the most popular cooling options available on the market today. One such solution is the ATS-10E-112-C2-R1, an advanced thermal solution for maximum heat dissipation.
This heat sink is a thermal solution for various types of electronics, including CPUs, FPGAs, and ASICs. The heat sink is constructed of a highly-effective heat dissipating material such as aluminum or copper alloy, and features low-profile dimensions and superior thermal performance. The ATS-10E-112-C2-R1 provides reliable cooling and can easily fit into most standard heat sinks.
The ATS-10E-112-C2-R1 provides excellent thermal performance, thanks to its efficient heat dissipation design. It uses an advanced cooling technology called “Flow Dynamics” that utilizes aerodynamically designed fins to enable maximum cooling performance. With this technology, heat is quickly and effectively drawn away from the CPU, FPGA, or ASIC and dispersed throughout the heat sink structure. This ensures that temperatures stay within specified operating ranges and that the lifespan of the electronics is maximized.
In addition to its efficient heat dissipation design, the ATS-10E-112-C2-R1 also features low operating noise. Its state-of-the-art design helps to reduce noise levels, allowing for quieter operation. The robust construction of the heat sink also ensures that it will retain its shape and strength even when placed under extreme temperatures and pressures. As such, the ATS-10E-112-C2-R1 is an ideal thermal solution for any electronics system.
The ATS-10E-112-C2-R1 is an excellent and cost-effective solution for cooling a variety of electronics in any environment. Its efficient flow dynamics design ensures maximum heat dissipation, while its low-noise operation ensures that noise levels won’t be an issue. The robust construction of the heat sink also ensures that it will remain reliable in the harshest environments. Overall, the ATS-10E-112-C2-R1 is an excellent choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference