| Allicdata Part #: | ATS-10E-114-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-114-C1-R0 |
| Price: | $ 3.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-114-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.86524 |
| 30 +: | $ 2.78754 |
| 50 +: | $ 2.63277 |
| 100 +: | $ 2.47785 |
| 250 +: | $ 2.32301 |
| 500 +: | $ 2.24557 |
| 1000 +: | $ 2.01326 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10E-114-C1-R0 is a compact, high-performance thermal - heat sinks that provides superior thermal management solutions for a wide range of applications. It is designed to efficiently dissipate heat produced by electronic components and circuit boards, and its size and performance makes it ideal for applications where space is at a premium.
The ATS-10E-114-C1-R0 consists of a large base and several heat pipes that effectively transfer heat away from the heat source. The larger base distributes heat from the source over a larger area, reducing localized heating and providing better thermal performance. The heat pipes are arranged in parallel, allowing for maximum efficiency in heat transfer from the source to the base. The base also features a reflector that improves thermal performance further.
The ATS-10E-114-C1-R0 is capable of dissipating up to 70W of heat, and its low profile and light weight make it ideal for applications where a lower volume and lighter weight are required. It is also designed to be reliable, requiring minimal maintenance. The heat sink is also well suited for applications that require more than one heat source, such as LED lighting systems, and can be used in conjunction with high-efficiency fans.
The ATS-10E-114-C1-R0 features a unique working principle that provides excellent thermal performance. The device uses thermal conductivity to transfer heat away from the heat source. Thermal conductivity is the ability of a material to absorb and dissipate heat, and is used as the primary method of heat transfer in the ATS-10E-114-C1-R0. The heat sink is able to dissipate heat with a thermal resistance of only 0.22 K/W, which is significantly lower than other thermal - heat sinks.
The ATS-10E-114-C1-R0 is suitable for a wide range of applications, including embedded systems, power supplies, telecommunications equipment, and many more. It is also capable of withstanding high temperatures, making it ideal for applications that require a high degree of heat dissipation. With its superior thermal performance and low profile design, the ATS-10E-114-C1-R0 is the ideal choice for any thermal management needs.
The specific data is subject to PDF, and the above content is for reference