| Allicdata Part #: | ATS-10E-121-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-121-C3-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-121-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for a variety of electronic devices, and heat sinks provide a critical component to this process. The ATS-10E-121-C3-R0 is a high-performance heat sink that is commonly used in the electronics industry. This heat sink is designed to maximize airflow to improve thermal performance and ensure the reliable operation of electronic components. This article will discuss the application field and working principle of the ATS-10E-121-C3-R0.The ATS-10E-121-C3-R0 is designed to provide excellent thermal performance in a variety of application fields. It is often used in consumer electronics, medical devices, industrial controls, and aviation systems. This heat sink is also suitable for cooling processors, power transistors, and other active components.The ATS-10E-121-C3-R0 is constructed from aluminum alloy which provides a combination of light weight and excellent thermal performance. This makes the heat sink more cost effective and reduces its overall size. The ATS-10E-121-C3-R0 also has a rugged construction that allows it to withstand the harsh environment of many industries.The working principle of the ATS-10E-121-C3-R0 is based on convective heat transfer. This process occurs when a hot surface exchanges heat with the air around it. In the case of the ATS-10E-121-C3-R0, the air is drawn in through the fins of the heat sink by a fan or other means. The air then circulates around the fins and absorbs heat, which is then dissipated into the surrounding environment.The ATS-10E-121-C3-R0 is designed to ensure efficient and reliable cooling of electronic components. This is achieved by its fin design, which reduces air resistance and increases the surface area for heat exchange. The ATS-10E-121-C3-R0 also has a unique patented pinning process which allows for the efficient and secure locking of components.The ATS-10E-121-C3-R0 is a high-performance heat sink that is suitable for a variety of application fields. It features a robust construction, light weight, and excellent thermal performance which make it an ideal choice for thermal management. The ATS-10E-121-C3-R0 utilizes convective heat transfer to ensure the reliable cooling of electronic components. Its unique pinning process also allows for secure locking of components for improved thermals and reliability.
The specific data is subject to PDF, and the above content is for reference