ATS-10E-130-C1-R0

Thermal - Heat Sinks

The ATS-10E-130-C1-R0 is a heat sink designed to improve system heat transfer performance. It is used in numerous applications, including computer cooling and consumer electronics. The device features a wide range of heat dissipation products with different designs for different applications, providing a complete thermal solution and greater efficiency.

Application Field

The ATS-10E-130-C1-R0 is commonly used for cooling computers, home theater receivers, stereo amplifiers, LCD monitors and other consumer electronics. The device is especially suitable for eliminating extreme heat in the case of industrial and military applications. In cases where more than one component is present, several heatsinks can be used for better efficiency.

Working Principle

Heat Sinks are designed to absorb and dissipate heat. The ATS-10E-130-C1-R0 is specifically designed to draw heat away from sensitive components and dissipate it to the surrounding environment. Through heat sinking, the device is able to effectively reduce the temperature of the component it is protecting. This, in turn, extends the product\'s life expectancy and improves its performance. The heatsink works by drawing heat away from the component through a series of ridges and fins, which then dissipates the heat to the air around the component, keeping it cool.

Heat Dissipation Technology

The ATS-10E-130-C1-R0 utilizes an innovative heat dissipation technology to maximize heat transfer to the environment outside of the device. This technology uses a combination of advanced aluminum and copper construction to draw the heat away from the component and dissipate it to the surrounding area. The device also uses a thermally conductive adhesive to ensure that the heat transfer is optimized.

Benefits

Heat Sinks are used to improve the performance and life expectancy of sensitive components by lowering temperatures. The ATS-10E-130-C1-R0 is specifically designed to draw heat away from the component and dissipate it to the surrounding environment, resulting in improved performance. Additionally, since it uses a thermally conductive adhesive, it ensures a higher rate of heat transfer, which further enhances the cooling performance. Lastly, the device is more cost-effective than traditional cooling methods, making it a great choice for reducing overall expenses.

Conclusion

The ATS-10E-130-C1-R0 is a heat sink used to improve the performance and life expectancy of sensitive components. The device is specially designed to absorb and dissipate heat away from sensitive components and dissipate it into the surrounding environment. The device is commonly used in computer cooling and consumer electronics, and is ideal for industrial and military applications. Additionally, the device utilizes an innovative heat dissipation technology to maximize heat transfer. This ensures a higher rate of heat transfer, resulting in improved performance and life expectancy of the component.