ATS-10E-130-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS17732-ND

Manufacturer Part#:

ATS-10E-130-C2-R0

Price: $ 5.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-130-C2-R0 datasheetATS-10E-130-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.83840
10 +: $ 4.70799
25 +: $ 4.44604
50 +: $ 4.18459
100 +: $ 3.92307
250 +: $ 3.66153
500 +: $ 3.40000
1000 +: $ 3.33462
Stock 1000Can Ship Immediately
$ 5.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.23°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical aspect of most electronic applications, especially in industrial and scientific domains, as it helps protect valuable equipment from damaging heat. The use of heat sinks is crucial to prevent damage from excessive heat, and the proper selection of the heat sink helps protect against thermal overload and failure. The ATS-10E-130-C2-R0 is a particularly effective heat sink for dissipating thermal energy and managing a wide range of low to moderate wattage applications.

Application Fields

The ATS-10E-130-C2-R0 is specifically designed for applications where low to moderate heat dissipation is required. Its use is particularly well suited to applications that need to dissipate a moderate amount of heat, such as HVAC systems, industrial equipment, and computers. Due to its low profile, it is also well suited for use in confined spaces, such as data centers where a precise fit is needed to meet uniform temperature conditions. Additionally, its uniform surface area and mechanical rigidity makes it a reliable solution for military and scientific applications that need to maintain thermal equilibrium in an exact manner. As the ATS-10E-130-C2-R0 is designed for applications using covered components, it is well suited for operating environments where dust, dirt, and dirt particles can cause damage.

Working Principle

The ATS-10E-130-C2-R0 is designed to regulate heat transfer by utilizing a large surface area and compression resistance design to disperse heat. This design helps to ensure that the heat is dissipated more evenly and significantly more efficiently than other traditional heat sinks, which only specialize in a single area of heat management.

To achieve the desired effect, the ATS-10E-130-C2-R0 has a combination of thermal pads and fins arranged in a grid pattern on the base, in order to increase the surface area and absorb more heat. This increased surface area helps to focus more heat on a single area, reducing the overall thermal differences from application to application. The fins are also specially shaped in order to maximize air flow around the heat sinks, which helps to disperse the heat more quickly. These fins are made of a highly durable metal, such as aluminum, and help reduce the risk of excessive heat damage.

Additionally, the ATS-10E-130-C2-R0 is designed to work in concert with other components, such as a fan, to improve system efficiency. The fan helps to circulate air around the fins and help maintain optimal thermal conditions. It is also designed to protect the heat sink from debris and dust, ensuring that the optimum thermal performance is consistently maintained.

Conclusion

The ATS-10E-130-C2-R0 is an extremely versatile heat sink that is specifically designed for a wide range of applications where low to moderate wattage dissipation is needed. Its combination of thermal pads and fins helps to maximize air flow and heat dissipation, allowing for optimal thermal performance in a wide range of operating environments. Its low profile makes it well suited for confined spaces, and its design ensures that the heat is dispersed evenly and efficiently.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics