| Allicdata Part #: | ATS-10E-137-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-137-C1-R0 |
| Price: | $ 3.01 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-137-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.71026 |
| 30 +: | $ 2.63718 |
| 50 +: | $ 2.49077 |
| 100 +: | $ 2.34423 |
| 250 +: | $ 2.19769 |
| 500 +: | $ 2.12444 |
| 1000 +: | $ 1.90466 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in an ever-growing technological world, especially for those heat-generating components like CPUs and GPUs. Heat sinks are a passive cooling solution that is widely used to absorb the heat generated by datacom and telecom devices, as well as gaming consoles and computers. The ATS-10E-137-C1-R0 heat sink is a reliable option in providing a cooling environment for delicate computing components.
The ATS-10E-137-C1-R0 is an aluminum extrusion-based heat sink that utilizes convection to naturally dissipate heat. The unit shape is a single-piece extrusion with an integrated aluminum base plate and integrated low-profile extrusion fins of 0.7 mm height. The extrusion fins are arranged in a straight row, and there are rows of integral mounting holes on the base. The heat sink also features integrated locating pins for easy installation.
The primary application field for the ATS-10E-137-C1-R0 is the cooling of processors and other digital components. It is designed to fit many types of board-level electronics, including CPUs, GPUs, FPGAs, high-end RAM modules, and other power components. The pin design allows for the heat sink to be simply attached to printed circuit boards with minimal required installation thickness and still support numerous components.
The ATS-10E-137-C1-R0 uses natural convection to dissipate heat away from components on a circuit board. Natural convection is the process in which heat from the component is transferred to the heat sink via conduction and then dissipated to the surrounding air. This allows the heat sink to stay relatively cooler while components on the board heat up, thus providing a cooler environment in which delicate components can thrive.
The heat sink also features a high thermal resistance, which means that it transfers heat away from the processor more quickly. This higher thermal resistance also provides more cooling to the board, increasing the system\'s overall thermal performance. Additionally, the extrusion fins also provide passive cooling, reducing the need for additional fans. This helps to minimize power requirements and noise levels.
The ATS-10E-137-C1-R0 is designed to be easy to install and provides for a secure and reliable connection to board-level components. The heat sink\'s design also allows for the easy expansion of existing cooling systems using the same product, by adding additional heat sinks to the existing solution. This increases the overall cooling capacity of the system, making it more efficient and less prone to overheating.
The ATS-10E-137-C1-R0 is an excellent thermal management solution for board-level components, providing a reliable cooling option for those delicate components that need it most. This heat sink offers a simple and easy to install solution while providing ample thermal performance for extended use and reliability. It\'s a great choice for those looking to provide their components with an optimal cooling environment.
The specific data is subject to PDF, and the above content is for reference