| Allicdata Part #: | ATS-10E-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sink technology is a key component in the modern IT and electronics industry. The ATS-10E-14-C1-R0 thermal heat sink is one of the most versatile, lightweight, and cost-efficient solutions on the market today.
The ATS-10E-14-C1-R0 thermal heat sink uses thermal dissipation technology to dissipate heat away from electronics, allowing users to maintain optimal operating temperatures and extend the lifespan of these devices. This heat sink is designed to be robust and resilient to last for a long time. Its frame is constructed from aluminum with a specialized anodized surface that has excellent thermal conductivity.
The ATS-10E-14-C1-R0 thermal heat sink has a thermally-conductive aluminum fin design that provides maximum surface area for heat conduction, ensuring efficient heat transfer. This heat sink has an optimized profile that can facilitate a 10W/mK thermal transfer between two components, enabling a higher thermal response with a smaller footprint. The ATS-10E-14-C1-R0 also uses patented Multi-Fin Technology, which further increases the surface area for heat dissipation.
The ATS-10E-14-C1-R0 thermal heat sink has a wide range of applications in the electronics industry. It can be used for cooling applications such as power amplifiers, switching power supplies, power semiconductor heat sinks, and other similar applications. It is also suitable for LED lighting, AC/DC converters, and automotive systems. This heat sink can also be used in two-phase thermal management applications, such as liquid cooling components and Peltier elements.
The ATS-10E-14-C1-R0 thermal heat sink works by dissipating heat away from the components that generate it. Heat is conducted away from the component by thermal interface materials and then absorbed by the heat sink. The heat is then dissipated by convection from the fins on the heat sink to the surrounding air. This process is highly efficient and ensures optimum thermal management even at high speeds. The heat sink also has a high thermal resistance, which helps ensure a uniform heat distribution.
The ATS-10E-14-C1-R0 thermal heat sink is a lightweight and cost-efficient solution that can be used in a variety of applications in the IT and electronics industry. It is a reliable product that is designed to provide excellent heat dissipation and thermal management. Thanks to its robust construction and Multi-Fin Technology, it can be relied upon to keep devices and components at optimal temperatures for a long time.
The specific data is subject to PDF, and the above content is for reference