ATS-10E-153-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS17757-ND

Manufacturer Part#:

ATS-10E-153-C2-R0

Price: $ 4.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-153-C2-R0 datasheetATS-10E-153-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.75480
10 +: $ 3.65526
25 +: $ 3.45215
50 +: $ 3.24904
100 +: $ 3.04592
250 +: $ 2.84286
500 +: $ 2.63980
1000 +: $ 2.58903
Stock 1000Can Ship Immediately
$ 4.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat Sinks are essential components for any electronic equipment, as they are responsible for dissipating heat away from critical components such as processors and other components. The ATS-10E-153-C2-R0 is an efficient heat sink that is designed to work with a range of different applications.

Application Field

The ATS-10E-153-C2-R0 is designed to provide cooling for a variety of different applications. It is suitable for use in telecommunications, automotive, medical, consumer electronics, and other areas where a high performing heat sink is required. It is particularly useful in applications where the components need to be distributed over a wide area, as this allows for uniform cooling across each component.

Working Principle

The ATS-10E-153-C2-R0 operates on the principle of conduction cooling. This means that the heat sink passively dissipates heat, drawing it away from the component and dissipating it to the surrounding environment. The base of the heat sink is typically made from a highly conductive material such as copper or aluminum sheet, which allows for efficient heat transfer. The fins then act as a radiator, dissipating the heat through convection to the surrounding environment.

The ATS-10E-153-C2-R0 also features an innovative design whereby the fins are split into two distinct sections and each section has its own fan. This allows for more efficient cooling, as the fans can be adjusted to provide cooling to different areas of the heat sink, depending on the environment and components needing to be cooled. Furthermore, the fans provide additional airflow, which also assists in dissipating heat away from the components.

Conclusion

The ATS-10E-153-C2-R0 is an efficient and high-performance heat sink that is suitable for a wide range of applications. Its conduction cooling design allows for efficient heat transfer and its innovative fan system makes it suitable for cooling in different environments and on components that require distributed cooling. It is an ideal solution for those needing an efficient and powerful cooling solution.

The specific data is subject to PDF, and the above content is for reference

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