ATS-10E-153-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-153-C3-R0-ND

Manufacturer Part#:

ATS-10E-153-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-153-C3-R0 datasheetATS-10E-153-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-10E-153-C3-R0 Thermal - Heat Sinks: Application Field and Working Principle

Thermal - Heat Sinks are an important part of electronics cooling devices and are designed to dissipate heat generated by electronic components and systems. They are installed in many different types of computer systems, such as a server, desktops, laptops and so on. ATS-10E-153-C3-R0 is a type of thermal - heat sink used in computer systems, its application field and working principle will be discussed in below.

Application Field of ATS-10E-153-C3-R0 Thermal - Heat Sinks

ATS-10E-153-C3-R0 thermal - heat sink is designed to dissipate the heat produced by processors, such as Intel Core i7 and Core i3 processor, Intel Xeon processor, AMD Ryzen 7 processor and AMD Ryzen 5 processor, and other processors which require up to 20W of power. And also, ATS-10E-153-C3-R0 is used in many all-in-one and SFF (small form factor) PCs.

Working Principle of ATS-10E-153-C3-R0 Thermal - Heat Sinks

The ATS-10E-153-C3-R0 thermal - heat sink is a type of aluminum cooler that helps to dissipate the heat generated by CPUs and other electronic components. It has a circular heatsink base, a heat pipe, and a fan. The heatsink base is made of aluminum alloy, which has high thermal conductivity; the finned pattern of the heatsink base increases the conduction area.The heat pipe transfers the heat produced by the CPU to the fins on the heat sink. The heat pipe consists of a sealed hollow copper tube, with a liquid-filled chamber inside. The heat pipe is connected to the CPU and the heat sink. When the liquid inside the pipe is heated by the CPU, it evaporates and flows up to the heat sink to the fins, where it condenses and releases the heat.The fan is located at the upper part of the heat sink and works by sucking out the heat generated by the CPU and other components, and blowing it away from the system. It also helps to keep the system cool down, which can prevent the CPU from being damaged by overheating.

Conclusion

ATS-10E-153-C3-R0 thermal - heat sink is a type of aluminum cooler designed to dissipate heat produced by CPUs and other electronic components. It is used in many different types of computers, such as servers, desktops, and laptops, and is especially useful for systems running high-power processors. It is composed of a heatsink base, heat pipe, and fan, which help to cool the system by transferring the heat away from the CPU and other components, and blowing it away from the system. In this way, it helps to protect your system from overheating.

The specific data is subject to PDF, and the above content is for reference

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