ATS-10E-155-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-155-C1-R0-ND

Manufacturer Part#:

ATS-10E-155-C1-R0

Price: $ 3.64
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-155-C1-R0 datasheetATS-10E-155-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.30498
30 +: $ 3.21552
50 +: $ 3.03698
100 +: $ 2.85831
250 +: $ 2.67964
500 +: $ 2.59032
1000 +: $ 2.32236
Stock 1000Can Ship Immediately
$ 3.64
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.34°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is one of the most important aspects of any electronic device. Heat sinks are devices used to dissipate heat from electronic components into the surrounding environment, and they are used in a wide variety of applications. The ATS-10E-155-C1-R0 heat sink is a world-class thermal management solution that is specifically designed for sophisticated consumer electronics applications. This article will discuss the application field and working principle of this specific heat sink.

The ATS-10E-155-C1-R0 heat sink is designed to dissipate the high heat generated by sensitive components in consumer electronics such as computers, televisions, phones, and gaming consoles. This heat sink features a highly efficient thermal performance that is ideal for managing the extreme temperatures of these components. The heat sink’s design makes use of a unique fin pattern that maximizes the amount of surface area exposed to the ambient air. This allows for more effective heat transfer and dissipation.

In addition, the ATS-10E-155-C1-R0 heat sink uses a combination of forced-air and passive cooling to ensure maximum performance and reliability. The heat sink is designed with a base plate with integrated fan, which actively circulates air around the fin pattern and draws heat away from the heat generating components. The air is then forced out of the heat sink by vertical fins and guided towards the sides of the device where it is then dissipated into the surrounding environment.

The ATS-10E-155-C1-R0 heat sink is also designed to accommodate a wide range of components, including CPUs, GPUs, RAM, and storage devices. This allows for a single, integrated heat sink that can be used to cool multiple components in a single device. This helps to keep the overall temperature of the device within acceptable ranges, which helps prevent component degradation and damage due to thermal stress.

In addition, the ATS-10E-155-C1-R0 heat sink features push-pin mounting to ensure that it remains securely attached to the motherboard. This ensures that heat is properly dissipated away from the components, even when the device is undergoing heavy usage. The heat sink also incorporates special fin designs that reduce noise levels and provide optimal airflow.

Overall, the ATS-10E-155-C1-R0 heat sink is an ideal thermal management solution for consumer electronics applications. It features an effective combination of active and passive cooling, along with an optimized fin pattern and push-pin mounting for maximum performance and reliability. The ATS-10E-155-C1-R0 also offers a compact design that makes it suitable for use in a variety of devices, including desktop computers, laptops, televisions, phones, and gaming consoles.

The specific data is subject to PDF, and the above content is for reference

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