| Allicdata Part #: | ATS-10E-161-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-161-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-161-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in order to ensure the efficient operation and increased lifespan of many electronic components. Heat sinks are one of the most commonly used methods of thermal management, and the ATS-10E-161-C1-R0 is an example of a modern offering used to effectively and correctly manage temperature levels. This article will look at the application field and working principle of the ATS-10E-161-C1-R0.
Application Field
The ATS-10E-161-C1-R0 heat sink is designed for cooling systems that use high-powered components that generate a lot of heat. Heat sinks are used in a variety of electronics and other electrical applications as a means to control and reduce the heat generated by these components. This particular model is suitable for applications such as computers, telecommunication equipment, digital equipment, visualization equipment, and industrial robots, providing excellent thermal management and dependable performance.
The ATS-10E-161-C1-R0 heat sink is lightweight and comes with a modern, discreet design, making it easy to install in any system or application. It is an excellent choice for those applications where space is limited and power dissipation levels are high.
Working Principle
Heat sinks work by transferring heat away from critical components and dispersing it out into the atmosphere. The ATS-10E-161-C1-R0 utilises a combination of highly efficient fin layout and compact design to ensure superior thermal performance. The heat sink is made from aluminium, which is an excellent thermal conductor and is able to effectively transfer heat away from components efficiently.
The fin layout of the ATS-10E-161-C1-R0 ensures a larger surface area is exposed to the surrounding air, which increases its ability to cool down. The design takes advantage of the natural temperature gradient that is created in the environment. Heat is dissipated from the hot components in the device, and the airflow created by the heat sink draws cool air in and disperses the hot air. This is an energy-efficient way to cool down components and allows them to last longer.
The ATS-10E-161-C1-R0 is designed to provide reliable cooling in a compact size. It is easy to install and requires minimal space, making it an ideal choice for applications that require high-performance cooling. The fanless design is also much quieter than fans, making it ideal for applications where noise is a concern.
Conclusion
The ATS-10E-161-C1-R0 heat sink is a modern offering that provides efficient and reliable cooling for high-powered components. It is suitable for a variety of applications due to its lightweight, compact design and superior thermal performance. The fanless design is also much quieter than fans, making it an ideal choice for applications where noise is a concern. With its excellent performance and reliability, the ATS-10E-161-C1-R0 heat sink is an excellent choice for those seeking high-performance cooling solutions for their electronic systems.
The specific data is subject to PDF, and the above content is for reference