| Allicdata Part #: | ATS-10E-167-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-167-C3-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-167-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and heat dissipation are essential for ensuring the safety of a wide variety of electrical and electronic systems and components. A Thermal - Heat Sink is a component that is specifically designed to effectively dissipate heat generated within the system into the surrounding environment. The ATS-10E-167-C3-R0 Thermal - Heat Sink is a combination of micro-finned aluminum body connected to a cylindrical lead-free solder. This design allows for the efficient dissipation of heat over a large surface area and into the surrounding environment.
The ATS-10E-167-C3-R0 is designed for high performance, and maximum efficiency. Its unique aluminum body design increases the thermal performance of the sink, by allowing the heat to be evenly dispersed over the entire surface area. The cylindrical lead-free solder allows for fast and efficient thermal conduction and dissipation. This ensures that the ATS-10E-167-C3-R0 can efficiently dissipate heat from the component or system it is attached to, and prevent any thermal damage to the system or component.
The ATS-10E-167-C3-R0 is a versatile Thermal - Heat Sink that can be used in a variety of applications. It is ideal for use with electronic components that generate significant amounts of heat, such as microprocessors, and other components in a power supply unit. The ATS-10E-167-C3-R0 can also be used for high temperature applications such as heaters, ovens, and other temperature sensitive systems.
The ATS-10E-167-C3-R0 is easy to install and requires no tools or specific assembly process. It is compatible with most standard mounting systems, and can be mounted on either PCBs or Chassis. This makes it a great option for customers who are looking for a reliable and efficient means of dissipating heat from their systems.
The design of the ATS-10E-167-C3-R0 makes it an attractive option for thermal management. Its combination of aluminum body and lead-free solder ensures maximum thermal efficiency, and its versatile design allows it to be used in a variety of applications. It is an ideal solution for customers looking for a reliable and efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference