| Allicdata Part #: | ATS-10E-169-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-169-C3-R0 |
| Price: | $ 3.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-169-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.24576 |
| 30 +: | $ 3.15777 |
| 50 +: | $ 2.98229 |
| 100 +: | $ 2.80690 |
| 250 +: | $ 2.63146 |
| 500 +: | $ 2.54374 |
| 1000 +: | $ 2.28059 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks play an important role in dissipating the enormous heat generated from any electronic component. ATS-10E-169-C3-R0 is a thermal heat sink developed to reduce the rate of heat buildup in the electronic devices from the usage of high speed processors and other components. The heat sink is a key component of the overall cooling system, and it is designed to cool down the surrounding environment.
The ATS-10E-169-C3-R0 is a combination of aluminum and copper conductive laminations, which is an ideal solution for cooling down high end processor systems. This thermal heat sink is designed with a specially designed fin pattern, which increases its effectiveness as well as its ability to absorb the heat generated from the system. The lamination is also designed to provide high thermal efficiency while being able to dissipate the heat quickly.
The ATS-10E-169-C3-R0 uses a combination of heat pipes and air flow technology to dissipate the heat build up that occurs when a component is under a high load. This allows the thermal sink to draw the heat energy away from the processor system and transport it to the multiple fins present in the upper part of the heat sink. The air flow technology utilizes a fan to further enhance the cooling.
The ATS-10E-169-C3-R0 provides a robust cooling system for high performance processors and other electronic components. This thermal heat sink is specially designed for high power processors which require extra cooling capacity. It can also be used for other applications, such as memory and storage devices. The thermal design is available in a variety of sizes, allowing it to be adapted to any size requirement.
The ATS-10E-169-C3-R0 has an aluminum housing which is designed to protect the copper lamination from any form of physical damage. The housing also houses the fan, which helps increase the air flow and the cooling capacity of the heat sink. The fan is designed to be low noise, making it more efficient and quiet.
The ATS-10E-169-C3-R0 is an excellent thermal heat sink for electronic components that need extra cooling power. The combination of aluminum and copper laminations provides maximum thermal efficiency, while the air flow and fan technology further enhance the cooling ability of the thermal heat sink. It also offers a robust cooling solution for processors, memory and storage devices. This thermal sink is an excellent choice for any application requiring extra cooling power.
The specific data is subject to PDF, and the above content is for reference