| Allicdata Part #: | ATS17776-ND |
| Manufacturer Part#: |
ATS-10E-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10E-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal management systems are an extremely important part of any electronics system, with components like heat sinks playing a major role in their development and application. The ATS-10E-170-C2-R0 heat sink is a unique design specifically intended for thermoelectric cooling applications, and is a quality product for efficient heat distribution. It is ideal for use in a variety of applications, from industrial electronics to medical systems. In this article, we will discuss the application field and working principle of the ATS-10E-170-C2-R0 heat sink.The ATS-10E-170-C2-R0 heat sink is designed to facilitate the transfer of heat from the module to the ambient environment. It features a dedicated combination of a thermoelectric cooler and high-performance fans for efficient heat distribution. The device is also equipped with a thermal pad to improve its efficiency, as well as other features such as a power switch for a more streamlined operation. The device has a low profile design, making it suitable for use in various types of enclosures.The ATS-10E-170-C2-R0 heat sink is typically used in thermoelectric applications and is highly regarded for its efficient cooling capabilities. It is capable of dissipating up to 10 watts of heat by conduction, surface area, and convection. This makes the device suitable for high-power applications such as consumer electronics, medical systems, and industrial electronics. It is also ideal for applications where thermal management is essential for optimal operation.The working principle of the ATS-10E-170-C2-R0 heat sink is based on principles of thermal conduction and convection. Heat is first distributed through the thermal pad and then to the heat sink. The heat sink is designed to maximize the surface area, allowing it to effectively transfer the heat from the module to the ambient environment. In addition, the device utilizes a combination of powerful fans to ensure that the heat is dissipated evenly. The device also has a power switch that allows the user to adjust the fan speed according to their needs.Overall, the ATS-10E-170-C2-R0 is a highly efficient thermal management system, designed to dissipate heat and cool down electronic devices quickly and efficiently. It is a low profile device that can be used in a variety of applications, including medical systems, industrial electronics, and consumer electronics. The device is equipped with powerful fans and a thermal pad for efficient heat distribution, as well as a power switch for streamlined operation.
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ATS-10E-170-C2-R0 Datasheet/PDF