| Allicdata Part #: | ATS-10E-171-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-171-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-171-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-10E-171-C1-R0 is a heat sink that can be used in a wide range of applications. It is a low profile, single-stage, Peltier cooling technology heat sink. Different versions of this heat sink are available depending on the amount of cooling required.
The heat sink utilizes a thermoelectric Peltier module. This module directly transfers heat from one side of the module to the other side when an electric current passes through it. This property of the module allows the heat sink to remove and dissipate large amounts of heat quickly and efficiently.
The heat is transferred from the module to the large aluminum heat sink fins. These fin designs are optimized to provide as much surface area as possible for effective heat dissipation. The shape and size of the fins along with their height make sure that the aluminum fins are exposed to the best possible air flow circulation.
This process is further optimized by a special heat transfer material, often a combination of ceramic materials, that is applied between the Peltier module and the fins. This material helps in dispersing heat away from the module into the aluminum fins. It also provides better thermal conductivity and provides a good medium for the heat to transfer from one side of the module to the other.
The heat sink also features several design parameters that help in optimizing the cooling performance of the device. The air inlet and outlet locations are carefully determined in order to maximize the air flow across the fins and maximize the cooling capacity. The fin profile and size are also optimized to provide the most favorable air flow paths for the most efficient heat dissipation. The ability to customize these parameters make the ATS-10E-171-C1-R0 a suitable and effective cooling solution for a variety of applications.
The heat sink can be used in a wide range of applications that require efficient cooling. It can be used in industrial and commercial cooling applications such as data centers, server rooms, and other high-temperature applications. It can also be used in power electronic devices such as power amplifiers and power supplies. This heat sink can also be used in the automotive industry and even in consumer electronics.
The ATS-10E-171-C1-R0 is a highly effective heat sink that can deliver an impressive amount of cooling in a small package. Its efficient design, optimized parameters, and customization options make it suitable to many applications.
The specific data is subject to PDF, and the above content is for reference