| Allicdata Part #: | ATS-10E-171-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-171-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-171-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
The ATS-10E-171-C3-R0 is a thermal-heat sink used to dissipate heat from other electronic components. As the heat is dissipated, the temperature of the component decreases and allows it to maintain optimal performance.
The ATS-10E-171-C3-R0 is designed to be used with components that require a large amount of cooling capacity. The heat sink is composed of a copper base, a fin stack, and an epoxy top coat. The copper base provides efficient heat conductivity for the efficient transfer of heat away from the component. The fin stack is designed to increase the surface area on which the air can pass over, allowing for efficient heat dissipation. The epoxy top coat is an insulating material that protects the other components from damage due to the high temperatures generated by the heat sink.
The ATS-10E-171-C3-R0 is typically used in high-powered control systems, such as in motor control systems or large data center applications. The heat sink is designed to keep the temperature inside the system at an optimal level, thereby ensuring that the components continue to function correctly. The heat sink is designed to dissipate the heat quickly, so it is important to ensure that the heat sink has adequate airflow. In addition, the efficiency of the heat sink can be increased by using a fan or other type of cooling system to ensure that the ambient temperature is kept at a level that allows for optimal performance.
The ATS-10E-171-C3-R0 is designed to dissipate heat from electronic components efficiently. The heat generated in the component is transferred to the heat sink, where it is dissipated into the surrounding air. This has the effect of keeping the inside of the component cool, while the outside is kept at a higher temperature. By effective use of the heat sink, components can remain cooler and be kept at optimal performance levels.
The ATS-10E-171-C3-R0 is a reliable and efficient way to dissipate heat from components, allowing them to stay at optimal performance levels. The heat sink is designed to transfer the heat quickly, making it ideal for applications that require a large amount of cooling capacity. It is also designed to have a high level of protection from environmental conditions, which is important for components that are exposed to high temperatures and humidity.
The specific data is subject to PDF, and the above content is for reference