| Allicdata Part #: | ATS-10E-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical for any electronic system such as computers, research instruments, and medical devices. Heat sinks are essential components that ensure heat efficiently moves away from components and maintains a desired temperature for optimal performance.
The ATS-10E-173-C1-R0 is a thermoelectric heat sink that is designed to actively remove heat in order to keep thermal loads stable. It integrates a sealed metal housing with an integrated vapor chamber, an advanced thermal management fan, and a dedicated heatsink to ensure that sensitive components stay cool.
The ATS-10E-173-C1-R0 is specifically designed for active cooling applications. It is designed to fit within a normal sized enclosure and can be integrated into any standard circuitry. The unit has a high-performance fan to maximize airflow and ensure that components are sufficiently cooled. The fan also enables the unit to maintain a high performance level over long periods of time.
The ATS-10E- 173-C1-R0 utilizes a vapor chamber to maximize cooling efficiency. The vapor chamber contains a sealed metal container with a unique chamber body structure. This structure consists of an inner chamber with two walls that are spaced apart in order to create a mini-climatic environment. This miniature climate provides an effective thermal gradient that helps actively absorb heat from components.
The ATS-10E- 173-C1-R0 is powered by a thermal management fan. This fan has a variable speed setting to maximize its cooling capabilities. The fan can be adjusted to optimize cooling performance in different environmental conditions. It also ensures that temperatures remain within the specified range.
The ATS-10E- 173-C1-R0 also includes a dedicated heatsink. This heatsink is designed to provide additional cooling to components. The heatsink is integrated into the vapor chamber, so it can make direct contact with heated components. This helps to ensure that no area is left un-cooled. The heatsink also eliminates any hotspots caused by high concentrations of heat.
The ATS-10E- 173-C1-R0 is ideally suited for applications such as industrial computers, medical devices, and automotive systems. It is designed to operate in a wide temperature range, which makes it suitable for use in the most demanding environments. It is also designed to be easy to install, so it can easily be integrated into most existing systems.
The ATS-10E- 173-C1-R0 is an ideal thermal management solution for any application that requires the efficient removal of heat. It is designed to be reliable and maintain peak performance for extended periods of time. Its integrated fan and vapor chamber ensure that components remain cool and stable. The dedicated heatsink further helps to maintain the desired temperature range. This makes the ATS-10E- 173-C1-R0 an ideal solution for thermal management in a variety of environments.
The specific data is subject to PDF, and the above content is for reference