ATS-10E-182-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-182-C1-R0-ND

Manufacturer Part#:

ATS-10E-182-C1-R0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-182-C1-R0 datasheetATS-10E-182-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.23379
30 +: $ 3.14622
50 +: $ 2.97133
100 +: $ 2.79657
250 +: $ 2.62181
500 +: $ 2.53441
1000 +: $ 2.27223
Stock 1000Can Ship Immediately
$ 3.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.48°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are essential components of any electrical or electronic device, as they provide a way to dissipate heat generated by a device\'s internal components. The ATS-10E-182-C1-R0 is a high-performance, multicore heat sink designed to provide low thermal resistance in extreme environments. This article will discuss the application field and working principle of the ATS-10E-182-C1-R0.

Application Field

The ATS-10E-182-C1-R0 is designed for use in extreme environments, such as those found in industrial, automotive, and military applications. The heat sink’s combination of aluminum, copper, and carbon-based materials provides superior thermal performance in high-temperature applications. Additionally, its robust construction makes it suitable for a range of industrial applications, including LED lighting, turbine engines, computers, and high-powered electronics.

Working Principle

The primary function of the ATS-10E-182-C1-R0 is to dissipate heat generated by electrical components, thereby ensuring that temperatures do not reach levels that can damage said components. The heat sink utilizes passive thermal management technologies, such as convection, radiation, and conduction, each of which play a vital role in heat dissipation.

Convection

Convection is the process by which the surface of a heat sink dissipates heat through air currents caused by surrounding air molecules. Heat generated by electrical components is absorbed by the heat sink and dissipates outward through the surface. The rate of heat absorption and dissipation is dependent on the type of material the heat sink is made of.

Radiation

Thermal radiation is used to disperse heat away from the surface of the heat sink. This type of dispersal occurs at a much faster rate than convection and requires much less energy. In the case of the ATS-10E-182-C1-R0, it is made of a combination of aluminum, copper, and carbon-based materials, which offer superior thermal radiation performance.

Conduction

The ATS-10E-182-C1-R0 uses conduction to further facilitate the dissipation of heat. Conduction involves the transfer of heat through direct contact between a heat source and a cooler object. The heat sink’s metal core is designed to conduct heat away from the surface, while the fins dissipate the heat into the air.

Conclusion

The ATS-10E-182-C1-R0 is an advanced, high-performance thermal solution designed for extreme environments. Its combination of aluminum, copper, and carbon-based materials provide superior thermal performance, while its robust construction makes it suitable for a range of industrial applications. Additionally, the heat sink utilizes passive thermal management technologies, such as convection, radiation, and conduction, each of which play a vital role in heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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