| Allicdata Part #: | ATS-10E-193-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-193-C1-R0 |
| Price: | $ 3.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-193-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.72223 |
| 30 +: | $ 2.64873 |
| 50 +: | $ 2.50160 |
| 100 +: | $ 2.35450 |
| 250 +: | $ 2.20735 |
| 500 +: | $ 2.13376 |
| 1000 +: | $ 1.91302 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10E-193-C1-R0 is a kind of thermal-heat sink which is widely applied in many engineering fields. As a kind of thermal management solution, ATS-10E-193-C1-R0 works by dissipating the heat generated by an electronics device or system and regulate its operating temperature to within a permissible range. In this way, the thermal management is realized.
In general, ATS-10E-193-C1-R0 consists of a base and a fin assembly. The base is typically composed of aluminum or copper with better thermal conductivity for quick heat transfer. The fins attached to the base are normally designed as a series of folded sheet metal or metal mesh with perforations, enabling improved exchange of warmth between the base and the surrounding air. With the combination of base and fin assembly, ATS-10E-193-C1-R0 provides an efficient heat radiating solution.
Meanwhile, ATS-10E-193-C1-R0 also has undergone continuous improvement to provide better performance. For example, the base can be coated with heat-conductive paste or ceramic material to exponentially increase the heat transfer capability, while the fins can be broadened to increase the exposed surface for cooling air. Besides, the fins can also be treated with black oxide or other methods to further boost the dissipation of heat.
In terms of application, ATS-10E-193-C1-R0 is predominantly used on medium-sized electronics systems. It is particularly suitable for specific cases which require broad-sized heat sink due to the large amount of heat generated. For instance, it is commonly seen in high power lasers, CPUs, gaming consoles, LED lighting, and other equipment where thermal management is highly essential. Besides, as a result of the easy to mount design and convenient assembly, ATS-10E-193-C1-R0 is also preferred in scenarios where the installation time is taken into consideration.
In summary, ATS-10E-193-C1-R0 is a thermal-heat sink which encompasses a base and a fin assembly. It works by dissipating the heat generated by an electronics device or system and regulating its operating temperature. With continuous improvement, ATS-10E-193-C1-R0 can provide efficient heat radiating solution with broadened fins, heat-conductive paste coating, black oxide treatment, and other methods. As such, it is typically used in medium-sized electronics systems with high power consumption and requires time-saving installation.
The specific data is subject to PDF, and the above content is for reference