| Allicdata Part #: | ATS-10E-196-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-196-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-196-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-10E-196-C3-R0 is an important part of the thermal management system for any kind of modern electronic devices. It\'s a heat sink that absorbs and dissipates heat in order to prevent electronic components from overheating and ultimately runs the risk of damage and failure. Heat sinks come in a variety of shapes, sizes, and materials to be customized for specific applications.
The ATS-10E-196-C3-R0 heat sink is made from a durable aluminum alloy base with multiple fins that extend from its body. This increases the surface area and allows for more effective heat transfer. The fins are soldered to the base and securely fastened for optimal efficiency. The unit also has a set of screws and spring-loaded attachment points for direct mounting on components.
The ATS-10E-196-C3-R0 is specifically designed to provide efficient cooling for high-power applications. It is capable of handling temperatures up to 60°C and airflows of 40CFM, making it a perfect choice for any device that generates considerable heat. The heat sink is also easily integrated with existing cooling systems and can be used in a variety of applications, such as servers, computers, and other high-end electronic equipment.
The ATS-10E-196-C3-R0 has a number of working principles that make it an incredibly efficient and reliable heat sink. Firstly, the large surface area of its aluminum fins provides an increased surface area for more effective heat conduction. The fins also increase the surface area to air ratio, thus increasing the thermal conductivity between the component and the environment, allowing for improved cooling performance.
Secondly, the ATS-10E-196-C3-R0 utilizes a standard displacement ventilation, which means that as the air flows through the sink, it accelerates and pushes down traveling warmer air toward the ground while it stirs cooler air upward. This natural convection technique provides a higher rate of heat dissipation compared to other methods. Additionally, the device is crafted using a superior aluminum alloy, which allows for a high-degree of strength and durability.
Finally, the ATS-10E-196-C3-R0 can be connected to other electronic components directly or through a specialized mounting bracket. This allows for easy installation in tight spaces that are difficult to access and affords the user every opportunity to achieve extreme power densities when using the device.
The ATS-10E-196-C3-R0 heat sink is the perfect choice for a wide range of high-power applications. It is extremely effective at dissipating heat, and provides robustness and durability for a long-term service. Furthermore, the device is easy to install and comes with a variety of mounting options, allowing it to be used in a diverse range of applications. With its superior efficiency and easy installation, the ATS-10E-196-C3-R0 is a top-notch thermal management solution for any device or system.
The specific data is subject to PDF, and the above content is for reference