| Allicdata Part #: | ATS-10E-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of the successful operation of most electronics. Without proper control of the operating temperature, the device may suffer from overheating, resulting in poor performance or complete failure. Heat sinks are devices that help keep the temperature of electronic components within the optimal range during operation. The ATS-10E-198-C3-R0 is a type of heat sink designed to provide effective cooling for a variety of electrical components.
The ATS-10E-198-C3-R0 Heat Sink is specifically designed to handle the cooling needs of various components in such electronic systems as cell phones, cameras, computers, etc. This advanced heat sink is constructed from a combination of metal and polyolefin and utilizes a high-efficiency conduction system, allowing it to dissipate the heat generated by the component efficiently and quickly. The backside of the ATS-10E-198-C3-R0 is designed with a variety of air cooling fins that provide excellent heat dissipation.
The ATS-10E-198-C3-R0 heat sink is designed to be mounted on a variety of electronic components, including microprocessors, transistors, power amplifiers, power drivers, and microcontrollers. It has a universal mounting hole pattern and can be attached to multiple components in a single system. The ATS-10E-198-C3-R0 heat sink is designed to provide optimal cooling performance with minimal installation effort.
The ATS-10E-198-C3-R0 Heat Sink features a unique design that allows it to work in both air and liquid cooling situations. It can be used as a standalone heat sink in air cooling environments, or it can be coupled with a liquid cooling system to provide more effective cooling. The ATS-10E-198-C3-R0 is also capable of handling higher temperatures than traditional air-cooled sinks, allowing it to be used in more extreme conditions.
The most important feature of the ATS-10E-198-C3-R0 Heat Sink is its ability to dissipate the heat generated by electronics in a very efficient manner. The ATS-10E-198-C3-R0 is able to dissipate heat up to twice as efficiently as other traditional heat sinks, making it an excellent choice for any electronic system. The ATS-10E-198-C3-R0 is also designed to be extremely durable and long-lasting, providing reliable performance for years.
In conclusion, the ATS-10E-198-C3-R0 Heat Sink is an excellent choice for providing efficient cooling for a variety of electronic components. Its unique design allows it to effectively dissipate heat without requiring extensive installation effort, and its durable construction ensures that it will provide reliable performance for years to come. The ATS-10E-198-C3-R0 Heat Sink is an excellent choice for any application that requires effective thermal management.
The specific data is subject to PDF, and the above content is for reference