| Allicdata Part #: | ATS-10E-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal components are an integral part of virtually every electronics system. As more sophisticated technologies and higher power levels interact with increasingly complex logic and microprocessors, thermal systems become increasingly necessary to ensure proper operation of the system. The ATS-10E-20-C3-R0 is one such thermal component, designed for elevated power levels with high precision and reliability.
The ATS-10E-20-C3-R0 is a low-profile, low-power thermal component. It is designed specifically for applications where there is limited space and a need for a moderately powerful cooling system. The ATS-10E-20-C3-R0 is a custom-manufactured two-phase heat sink—a device that dissipates heat from electronic components. The heat sink consists of two main parts: a metal base plate and a set of cooling fins.
The metal base plate of the ATS-10E-20-C3-R0 transfers heat away from the components to the cooling fins. The cooling fins are made of aluminum to facilitate the transfer of heat throughout the heat sink. The metal base plate also acts as a barrier to the outside environment, preventing outside air from entering the system and affecting the cooling process. The cooling fins are designed with a wavy pattern, allowing for increased surface area and improving heat conduction.
The ATS-10E-20-C3-R0 has a thermal resistance of 0.25°C/W, making it well-suited for both high- and low-power applications. The thermal resistance value indicates the rate at which heat is dissipated from the component. The lower the value, the more effectively heat is transferred away from the component. The ATS-10E-20-C3-R0 also has a power rating of 20W, ensuring that it can handle elevated power levels with ease.
The ATS-10E-20-C3-R0 is made from the highest quality materials to ensure both precision and reliability. It is designed for easy installation and requires no additional hardware or software for installation. The heat sink is pre-drilled for mounting components, ensuring that installation can be done quickly and easily. Additionally, the ATS-10E-20-C3-R0’s mounting hardware is included with each unit.
The ATS-10E-20-C3-R0 is an ideal choice for applications that require a high performance, low-profile thermal management system. Its low-profile design makes it perfect for environments with limited space, while its efficient heat dissipation ensures that components will stay at safe operating temperatures. The ATS-10E-20-C3-R0 is designed to provide reliable thermal cooling for a variety of systems, from microprocessors to high power components.
The specific data is subject to PDF, and the above content is for reference