| Allicdata Part #: | ATS-10E-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks
Thermal heat sinks are widely used in the electronics industry to solve various thermal management problems. In particular, they are used to cool down electronic components and help dissipate heat in various applications. The ATS-10E-209-C1-R0 is a heat sink for integrated circuits, and it is designed to help manage the heat generated by the component in order to maintain its thermal balance. This article will explain the application field and working principle of the ATS-10E-209-C1-R0.
Application Field
The ATS-10E-209-C1-R0 is designed to provide cooling for integrated circuits and other electronic components that require thermal management. It is generally used for power supplies, amplifiers, and other electronic components that require heat dissipation. It is especially suited for applications that require high thermal performance, such as high-power transistors. Additionally, it is designed for low power loss, and provides excellent thermal transfer from the component to the surrounding environment.
Working Principle
The ATS-10E-209-C1-R0 is designed to take full advantage of the Laws of Thermodynamics in order to provide effective heat transfer. The basic principle of operation is as follows: Heat is generated by the component and transferred to the heat sink, which then dissipates the heat to its surroundings. The heat sink is made of metal, which helps dissipate the heat away from the component. This type of heat sink also has a built-in fan to help move the heat away from the device as quickly as possible.
The heat sink is designed to maximize the surface area in contact with the component. This helps maximize the amount of heat that can be transferred away from the component. A copper baseplate helps spread the heat away from the component to the rest of the sink, and this helps ensure that the device does not overheat. Finally, a layer of thermal compound is present between the component and the heat sink, which helps maximize the thermal connection between the two components.
The ATS-10E-209-C1-R0 is able to effectively dissipate heat from integrated circuits and other electronic components that require thermal management. It works by taking advantage of the Laws of Thermodynamics, and is designed to maximize the amount of heat that can be dissipated away from the component. By utilizing a fan in addition to the copper baseplate and a layer of thermal compound, this type of heat sink is able to provide excellent heat dissipation away from the component.
The specific data is subject to PDF, and the above content is for reference