| Allicdata Part #: | ATS-10E-21-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-21-C1-R0 |
| Price: | $ 4.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-21-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.75921 |
| 30 +: | $ 3.55047 |
| 50 +: | $ 3.34152 |
| 100 +: | $ 3.13267 |
| 250 +: | $ 2.92383 |
| 500 +: | $ 2.71499 |
| 1000 +: | $ 2.66278 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10E-21-C1-R0 is a thermal heat sink, with a broad array of applications and an easy-to-understand operating principle. It is a versatile device that is utilized mainly to manage the thermal profiles of electronic components and components that generate heat during normal operation. The application field for this device is broad and it can be used in many different ways.In order to understand the application field and the working principle of the ATS-10E-21-C1-R0, it is important to understand how it is different from other thermal or heat sink technologies in terms of cooling. The device is designed to conduct heat away from the components that it is attached to, which creates a temperature differential between the surfaces of the components. This differential is managed by the ATS-10E-21-C1-R0, and it allows for a large amount of cooling to occur.
The primary application field for the ATS-10E-21-C1-R0 is in the area of electronics, and it is often used in conjunction with warm components in order to keep them from overheating. This is because the device is able to dissipate the heat away from the components quickly, which prevents them from continuing to rise to potentially damaging levels of heat. The device is also used in situations where cooling of a component is necessary to maintain its optimal operating temperature. In this way, the ATS-10E-21-C1-R0 can act as an efficient and inexpensive way to keep a component operating at its peak performance.
The working principle of the ATS-10E-21-C1-R0 is simple. The device is placed between the surface of the component that emits heat and the surface of the cooling source. The device then acts as a bridge, conducting the heat away from the component and out to the cooling source. This is followed by the cooling source absorbing the heat, and dissipating it away from the component. This process is aided by the presence of a thin layer of thermal gel, which helps to reduce the amount of heat that is conducted away, as well as allowing for more effective heat dissipation.
The ATS-10E-21-C1-R0 is an effective way to keep components operating within their optimal temperatures, as well as protecting them from potentially damaging levels of heat. It is a versatile device that can be used in a variety of situations, and its simple operating principle makes it very easy to understand and utilize. This makes the ATS-10E-21-C1-R0 an ideal choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference