ATS-10E-23-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-23-C1-R0-ND

Manufacturer Part#:

ATS-10E-23-C1-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-23-C1-R0 datasheetATS-10E-23-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components to dissipate heat in many electronic systems.

ATS-10E-23-C1-R0 is a new type of heat sink designed to provide superior thermal performance and greater heat dissipation in a lightweight package. It is a self-contained one-piece aluminum body with unique cooling chambers and heat pipes to transfer heat away from the component, or area to be cooled. It also includes a unique heat spreader that helps spread the heat evenly over the entire surface to ensure maximum cooling.

ATS-10E-23-C1-R0 is widely used in a variety of applications including, but not limited to: Computers, Consumer Electronics, Telecommunications and Networks, Industrial Automation Systems, Robotics, and Automotive. It can be used with any type of components and provides reliable, efficient heat dissipation.

The ATS-10E-23-C1-R0 works by transferring heat away from the component or area to be cooled. Heat is generated by the component or area, and then transferred by thermal transfer medium within the heat sink. The heat spreader provides the additional thermal conduction needed to evenly transfer the heat away from the component or area to be cooled. Heat is then dissipated into the atmosphere, where the thermal exchange medium can absorb it.

The ATS-10E-23-C1-R0 is designed to be extremely efficient and lightweight, and is capable of dissipating heat at a rate of up to 400 watts. It has a compact design that makes it easy to install and is very cost effective. It is also able to withstand high temperatures and is able to operate in extreme conditions, making it an ideal choice for many applications.

The ATS-10E-23-C1-R0 is an excellent choice for a variety of applications requiring efficient thermal management. It provides reliable and efficient thermal performance, and is lightweight and cost effective. With its efficient cooling performance, it is able to dissipate heat quickly and reliably.

The specific data is subject to PDF, and the above content is for reference

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