ATS-10E-27-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction of ATS-10E-27-C3-R0

The ATS-10E-27-C3-R0 is a thermal-heat sink designed to cool down computer components and other electronic devices. It has a unique design which allows for efficient heat dissipation, ensuring the components are not overheated during prolonged usage. The thermal-heat sink also features a robust construction, making it durable and reliable.

Application Field

The ATS-10E-27-C3-R0 can be used in a variety of applications. It is primarily designed for use in computers and other electronic devices. It can also be used in industrial and commercial settings to cool down computers, servers, and workstations. In addition, it can be used to improve the performance of heating and cooling systems.

Construction

The ATS-10E-27-C3-R0 is constructed from high quality aluminum. The heatsink is coated with a black anodized finish for a sleek and modern look. It features a single-window design with two windows, allowing air to flow freely around the different components, providing sufficient cooling.

Design Features

The ATS-10E-27-C3-R0 features an advanced cooling system which enables it to quickly dissipate heat. The heatsink has four copper plates which are capable of absorbing and dissipating heat from the components. Additionally, the plates have multiple fins which further improve the heat dissipation process. The unique design of the fins allows for greater surface area, meaning more heat can be dissipated from the components.

Working Principle

The ATS-10E-27-C3-R0 works by absorbing heat generated by the components and then dissipating it into the surrounding air. The heatsink is designed to draw in air and create an airflow which passes over the components, absorbing the heat. The fins on the copper plates then act as radiators, dissipating the heat into the surrounding environment. This ensures that the components do not get too hot during extended periods of usage.

Conclusion

The ATS-10E-27-C3-R0 is an excellent choice for cooling down components in computers and other electronic devices. Its unique design and robust construction make it extremely reliable and efficient. It is capable of quickly and effectively absorbing and dissipating heat, ensuring optimal performance and preventing components from overheating.

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