ATS-10E-30-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-30-C1-R0-ND

Manufacturer Part#:

ATS-10E-30-C1-R0

Price: $ 7.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-30-C1-R0 datasheetATS-10E-30-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.62760
30 +: $ 6.25947
50 +: $ 5.89138
100 +: $ 5.52315
250 +: $ 5.15494
500 +: $ 4.78673
1000 +: $ 4.69468
Stock 1000Can Ship Immediately
$ 7.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is a critical aspect of any electronic system. The right heat sink can be the difference between a successful system and a system that fails due to overheating. The ATS-10E-30-C1-R0 thermal management component from Advanced Thermal Solutions Inc. (ATS) is a compact, high-power heat sink designed for a wide range of applications. This article will discuss the ATS-10E-30-C1-R0 application field and its working principle.

The ATS-10E-30-C1-R0 is a thermal management component that is designed for use in high-power electronic devices such as servo drives, electronic speed controllers, variable speed drive systems, and power control units. It has an extremely efficient heat transfer capability, making it suitable for a wide range of operating temperatures. The ATS-10E-30-C1-R0 can be used in systems that require up to 1.3kW of dissipation. This makes it perfect for applications that generate large amounts of heat in a confined space.

The ATS-10E-30-C1-R0 is a highly efficient heat sink. It has a hollow construction, which creates a chimney effect. This allows hot air to be rapidly expelled from the system, allowing the heat sink to operate more effectively. The device is also designed to ensure that its fins always remain clean, which helps maximize its performance. In addition, the ATS-10E-30-C1-R0 has an oversized fin stack surface area, which helps it transfer heat more efficiently.

Heat sinks are effective because they use the thermal properties of metals to transfer heat away from the device they are attached to. The ATS-10E-30-C1-R0 is designed to provide maximum heat transfer. It has been constructed from anodized aluminum, which is a highly efficient conductor of heat. This helps the heat sink to quickly dissipate heat away from the device, allowing it to operate at its optimal temperature.

The ATS-10E-30-C1-R0 also uses anodized fins to further improve its heat transfer properties. The fins are designed to be arranged in such a way that they create a combination of turbulence and laminar flow. This helps to maximize the amount of air passing over the fins, which increases the rate of heat transfer. The fins also serve to protect the device from oxidation, as anodized aluminum is highly resistant to corrosion.

The ATS-10E-30-C1-R0 heat sink is designed to be light in weight and compact in size, making it easy to install. It has a single plane contact surface, which helps to uniformly dissipate heat and avoid hotspots. It also has an integrated fan, which helps to further cool down the system. The fan can be easily removed for cleaning or maintenance purposes.

The ATS-10E-30-C1-R0 is a compact, high-power heat sink that is ideal for a wide range of applications in the electronics industry. Its efficient heat transfer capabilities, combined with its lightweight construction and integrated fan, make it an ideal choice for applications that require reliable cooling. It is sure to meet the needs of any technology that requires a reliable thermal management component.

The specific data is subject to PDF, and the above content is for reference

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