| Allicdata Part #: | ATS-10E-38-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-38-C3-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-38-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10E-38-C3-R0 Heat Sink is a thermal management solution designed to provide precise thermal control for a wide range of applications. It is an efficient, robust, cost-effective and versatile heat sinking device suitable for many applications in the electronics and semiconductor industries. It has been successfully used in the mission critical and industrial applications for a variety of applications ranging from high power and long-term thermal stability to cooling of sensitive components and fast switching devices.
The ATS-10E-38-C3-R0 Heat Sink is designed to operate in temperatures ranging from -50°C to +65°C. Its design is optimized for maximum heat transfer and reliability. It is a three-part assembly consisting of two ventilated heat sinks and an extrudable aluminum surface that contacts the components and is soldered in place. The heat sinks have an EMI/RFI shielding to ensure that electromagnetic interference is eliminated. The main body is made of extrudable aluminum, which provides durability and flexibility in its shape and design.
The ATS-10E-38-C3-R0 Heat Sink utilizes two independent passive cooling technologies, a forced air cooling fan and a thermally conductive aluminum finned heat sink. The forced air cooling fan can move air between the environment and the device at the speed required to achieve the desired result. The thermally conductive aluminum finned heat sink provides additional heat dissipation, eliminating the need for external radiation. By combining these two passive cooling technologies, the ATS-10E-38-C3-R0 Heat Sink can achieve a wide range of thermal performance over a wide temperature range.
The ATS-10E-38-C3-R0 Heat Sink is typically used in applications that require high temperature, reliability and efficient thermal control. This includes high power and long-term thermal stability in applications such as telecommunications, automotive and military electronics, as well as cooling of sensitive components such as ICs, FPGAs, and other sensitive devices. The ATS-10E-38-C3-R0 Heat Sink is also suitable for fast switching devices such as power semiconductors and relays.
The ATS-10E-38-C3-R0 Heat Sink is designed to optimize thermal performance for a variety of applications. It uses a combination of air convection and heat transfer through a metal base and finned aluminum extrusion to dissipate heat. The air convection helps reduce overall temperature and prevents short loops while the thermally conducted aluminum finned heat sink dissipates heat away from the components. This combination of technologies helps maximize thermal performance and efficiency over a wide range of temperatures.
The ATS-10E-38-C3-R0 Heat Sink is a reliable and cost-effective way to manage the thermal performance requirements of a variety of devices. It is designed to meet the needs of mission critical and industrial applications, as well as other applications which require thermal management solutions. Its robust design and versatility make it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference