ATS-10E-40-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.55°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal - Heat Sinks are commonly used in a variety of applications to manage the temperature of a device. They are typically designed to be thermally efficient and are available in a variety of styles and sizes. The ATS-10E-40-C1-R0 is a heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS) which is suitable for many applications. This article will provide an overview of the ATS-10E-40-C1-R0 heat sink and its potential applications.Application FieldThe ATS-10E-40-C1-R0 heatsink is suitable for a wide range of applications. It can be used in any system that requires cooling of high power components such as processors, field-programmable gate arrays (FPGAs), and digital signal processors (DSPs). It is designed to provide high levels of thermal performance and low acoustic noise levels.The ATS-10E-40-C1-R0 heat sink is also designed to provide good electrical isolation and distribute heat evenly across the surface of the heatsink. This makes it ideal for applications such as automotive, avionics, industrial, and medical systems that require a high power efficiency and low acoustic noise levels.The ATS-10E-40-C1-R0 is also designed for systems that need to perform in extreme temperatures, from -40° C to +100° C. Its flexibility allows it to handle both high and low temperatures with ease.Features and BenefitsThe ATS-10E-40-C1-R0 heat sink has many features and benefits. It provides high performance and low thermal resistance, allowing it to provide an effective cooling solution even in extreme temperatures.The ATS-10E-40-C1-R0 heat sink includes a patented direct thermal path (DTP) feature that allows for improved heat dissipation. The DTP reduces the thermal resistance between the heat source and the heatsink, resulting in more efficient cooling. This heat sink also features two separate aluminum coolers that effectively transfer the heat from the CPU to the heatsink’s surface. The combination of the two coolers, along with the fins of the heatsink, create an effective thermal transfer between the heat source and the surface, resulting in better cooling performance. The ATS-10E-40-C1-R0 heat sink is designed to fit in tight spaces, which makes it great for applications such as laptops, tablets, and other applications where space is a premium. It also features an integrated mounting system that allows it to be easily mounted in an enclosure. The ATS-10E-40-C1-R0 also features a resilient design that is resistant to vibration, ensuring optimal performance even in rugged environments. Working PrincipleThe ATS-10E-40-C1-R0 heat sink works through a process known as thermal conduction. It works to transfer heat away from the components of the system by passively moving heat away from the components and into the fins of the heatsink.At the core of the heat sink is a baseplate that is designed to efficiently conduct heat away from the component and into the fins. The fins are designed to dissipate the heat into the air, which allows the system to remain cool and operate efficiently.The integrated mounting system of the ATS-10E-40-C1-R0 also plays an integral role in its performance. The mounting system allows for the heat sink to be securely mounted in an enclosure, allowing it to better distribute the thermal energy away from the components. ConclusionThe ATS-10E-40-C1-R0 heat sink is a well-designed thermal-management solution that is suitable for a variety of applications. It is designed to provide effective cooling even in extreme temperatures, while also providing low acoustic levels and high power efficiency. The integrated mounting system allows it to be easily mounted in an enclosure, and the resilient design ensures optimal performance even in tough environments. Finally, the patented direct thermal path feature ensures efficient heat transfer between the heat source and the heatsink, resulting in improved cooling performance.

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