| Allicdata Part #: | ATS17838-ND |
| Manufacturer Part#: |
ATS-10E-51-C2-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-51-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.47760 |
| 10 +: | $ 3.38814 |
| 25 +: | $ 3.29666 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks can be a critical component of many electronic systems. The ATS-10E-51-C2-R0 is one such component that is designed specifically to dissipate heat effectively under a range of environmental conditions. The product is designed to provide reliable and consistent thermal management performance.
The ATS-10E-51-C2-R0 is a thermal heat sink that is specifically designed to dissipate heat from electronic components. It does not require the use of a fan or other active cooling element and is constructed using a special aluminum alloy which is anodized for an attractive black finish. The heat sink is constructed using a finned design which allows for an enhanced level of cooling performance and efficiency. The fin design also reduces the amount of internal surface area, allowing air to pass more easily through the device. The heat sink is also constructed with the ability to be mounted in a variety of positions, allowing for a more tailored thermal management solution.
The ATS-10E-51-C2-R0 operates on a simple principle. The heat sink is connected to the electronic component and when the electronic component heats up, the temperature of the heat sink increases accordingly. As the temperature of the heat sink increases, it absorbs more and more of the heat emanating from the component and transfers it away from the component to be dissipated elsewhere. This process of thermal transfer is known as ‘thermal conduction’ and is one of the most efficient methods of dissipating heat from an electronic device.
The ATS-10E-51-C2-R0 is an excellent choice for any system that needs efficient thermal management performance. The product is designed to provide reliable and consistent performance for a variety of applications. The heat sink’s finned design allows for improved cooling performance and efficiency while its anodized aluminum construction provides a strong and attractive finish. The heat sink is also engineered to be mounted in a variety of positions, allowing for a more tailored thermal management solution. The ATS-10E-51-C2-R0 is an ideal solution for anyone looking for reliable and efficient thermal performance.
The specific data is subject to PDF, and the above content is for reference