| Allicdata Part #: | ATS-10E-52-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-52-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-52-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to cool electronic components such as CPUs, GPUs, LEDs, and FPGAs. They are made from metal, usually aluminum, and have a variety of configurations that allow for efficient heat transfer. ATS-10E-52-C3-R0 is a type of thermal – heat sink designed to dissipate heat from electronic components. This article will discuss the application field and working principle of this type of heat sink.The application field of ATS-10E-52-C3-R0 heat sinks is wide and varied. They are commonly used in computers as well as other consumer electronics, such as microwaves, televisions, and sound systems. They are also found in industrial applications such as automotive systems, laboratory equipment, and medical devices. Additionally, they are used in a variety of devices that require cooling, including laser-based systems, LED lighting, solar cells, and more.The working principle of ATS-10E-52-C3-R0 heat sinks is relatively simple. The device consists of a large metal plate that is designed to draw heat away from the component it is attached to. The plate is affixed to a heatsink, which is able to dissipate this heat into the surrounding environment. The plate and the heatsink are connected to each other via a thermally conductive material such as copper or aluminum, which allows the heat to be efficiently transferred from the component to the heatsink.In order to maximize the effectiveness of the heat sink, it must be properly installed. Typically, it should be mounted securely to the surface of the component using a thermally suiting material such as thermal tape or thermal paste. Additionally, the heat sink should be placed in an area where it is able to receive optimum airflow, as this will allow it to dissipate the heat more effectively.In conclusion, ATS-10E-52-C3-R0 heat sinks are an effective means of cooling electronic components. They are commonly used in a variety of applications, from consumer electronics to industrial devices. Additionally, they employ a simple working principle, which involves transferring heat to a heatsink via a thermally conductive material. When installed correctly, ATS-10E-52-C3-R0 heat sinks can be an effective cooling solution for a variety of electronic components.
The specific data is subject to PDF, and the above content is for reference