| Allicdata Part #: | ATS-10E-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-10E-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are an important component in many consumer, industrial and other electronic applications. A heat sink is used to transfer and dissipate heat away from components in order to prevent overheating and improve performance. The ATS-10E-60-C1-R0 is a popular thermal – heat sink, which is used in a wide range of applications.
ATS-10E-60-C1-R0 Application Field
The ATS-10E-60-C1-R0 thermal – heat sink is suitable for many electronic and electric applications, including but not limited to:
- IT equipment (servers, computers, storage, etc.)
- Automotive electronics
- Industrial control systems
- Security and surveillance systems
- Telecommunications equipment
- Smart home systems
- Medical devices
- Power supplies
- Renewable energy systems
- Military and aerospace applications
The ATS-10E-60-C1-R0 thermal – heat sink is designed to meet the highest demands from a variety of different applications. It provides excellent cooling efficacy and performance over a wide temperature range. The thermal – heat sink has a high degree of temperature uniformity and a long thermal diffusion rate. It also provides superior heat transfer and ability to dissipate heat in a variety of environments. It has a good dielectric strength and provides excellent EMI protection.
ATS-10E-60-C1-R0 Working Principle
The ATS-10E-60-C1-R0 thermal – heat sink consists of a copper baseplate with tungsten and aluminum fins optimized to dissipate heat from components. The copper baseplate works as a conductor to transfer heat from the device or component to the fins. The tungsten fins increase the overall thermal performance by providing an efficient thermal conduction path from the copper baseplate. The aluminum fins are designed to reflect and absorb heat energy, thus improving the thermal resistance and providing a better heat dissipation performance.
To further enhance thermal performance, the ATS-10E-60-C1-R0 can be combined with other cooling components such as active or passive fans. By attaching the thermal – heat sink to a fan, airflow across the fins is increased to help remove the temperature of the component. This further helps to improve the thermal conduction and heat dissipation performance of the ATS-10E-60-C1-R0.
The ATS-10E-60-C1-R0 thermal – heat sink is a reliable and efficient cooling solution for many applications. It is easy to install and maintain, making it an ideal solution for improving system performance and reliability. With its high performance and longevity, the ATS-10E-60-C1-R0 thermal – heat sink is ideal for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference