| Allicdata Part #: | ATS-10E-74-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-74-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-74-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10E-74-C3-R0 Thermal - Heat Sinks
Thermal - Heat Sinks are essential components in many electronic applications for heat dissipation. The ATS-10E-74-C3-R0 is a type of Heat Sink made of aluminum and is specially designed for cooling high-powered semiconductor devices. It has excellent thermal properties, which make it an ideal choice for cooling sensitive and power-intensive circuits.
Application Field
The primary application field of the ATS-10E-74-C3-R0 Thermal - Heat Sinks is in power-intensive electronic systems, such as the high-end CPU, GPU, and power transistor cooling systems. It is a highly reliable and efficient heat transfer and cooling solution for various applications such as audio, video, automotive, server, and industrial computing. It is also suitable for use in medical systems, radar systems, aerospace systems, and military systems. The thermal efficiency and functions of the ATS-10E-74-C3-R0 Thermal - Heat Sink are suitable for use in high power-density and high-temperature applications, and is also suitable for applications with radiation or vibration.
Working Principle
The ATS-10E-74-C3-R0 Thermal - Heat Sink works on the principle of conduction heat transfer. Heat generated by electronic components, such as CPUs and GPUs, is transferred to the metal body of the heat sink through conduction. The fins on the heat sink help increase the surface area, which improves the airflow and cooling efficiency. A fan or other type of air-cooling system can also be attached to the heat sink, which further increases the cooling efficiency. When heat is dissipated from the heat sink, it can be dissipated into the environment or thermally recycled into another device or system.
The metal body of the ATS-10E-74-C3-R0 Heat Sink is also designed with special features to optimize heat dissipation. The body is designed with an adherent surface profile to provide maximum contact between the heat sink and the electronic components being cooled, and also to improve airflow. The fins are also specially designed to ensure optimal airflow, and the grooves in the surface of the heat sink help dissipate heat from between the fins.
The ATS-10E-74-C3-R0 Thermal - Heat Sink is also designed with special features to minimize noise and vibration. The special grooves and recesses help reduce noise caused by air turbulence, which can significantly reduce the noise level emitted from the cooling system. The grooves and recesses also act as dampers, which help absorb vibration, further improving the operation of the cooling system.
Conclusion
The ATS-10E-74-C3-R0 Thermal - Heat Sink is a reliable and effective cooling solution for power-intensive electronic applications. It is designed with many features to ensure optimal cooling, such as the adherent surface profile, optimized fin design, and special grooves to further improve heat dissipation and reduce noise. With its excellent thermal properties and features, the ATS-10E-74-C3-R0 Heat Sink is an ideal choice for cooling high-powered semiconductor devices.
The specific data is subject to PDF, and the above content is for reference