| Allicdata Part #: | ATS-10E-77-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-77-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-77-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are temperature regulation components that are designed to dissipate, control, or otherwise manage the heat generated by other components or devices in a circuit or system. ATS-10E-77-C3-R0 is a type of heat sink from Advanced Thermal Solutions (ATS) that can be used in a variety of applications. In this article, we’ll discuss the application fields and working principle of ATS-10E-77-C3-R0.
Application fields
Heat sinks are used in a range of electronics and ICT applications. The ATS-10E-77-C3-R0 is a very versatile heat sink that can be used in many industrial, telecommunications, automotive, and consumer applications. Some of the most common applications for ATS-10E-77-C3-R0 include:
- Automotive electronics: The ATS-10E-77-C3-R0 is often used in automotive systems, both for active cooling of components and passive heat dissipation.
- Telecommunication systems: In telecommunication systems, the ATS-10E-77-C3-R0 is used to dissipate heat from components that process large amounts of data.
- Industrial systems: The ATS-10E-77-C3-R0 is used in many industrial machines, such as robots and CNC machines, to help dissipate the heat generated by the motor or processors.
- Consumer electronics: The ATS-10E-77-C3-R0 is used in many consumer electronics, such as TVs, laptops, and handheld devices, to regulate temperatures and prevent device malfunctions.
Working Principle
The ATS-10E-77-C3-R0 is designed to dissipate heat away from critical components in a circuit or system. The heat sink features a large aluminum base plate with a finned profile for maximum heat dissipation. The fins are designed to allow air to flow over the entire surface of the heat sink, further improving its cooling capacity. The ATS-10E-77-C3-R0 is also designed to optimize contact between the device and the heat sink. This helps to maximize the thermal performance of the heat sink, and reduce the risk of overheating.
The ATS-10E-77-C3-R0 is also designed to dissipate heat evenly. This helps to prevent overheating and possible component damage in circuits or systems where components are situated close together, or where the components generate varying amounts of heat. The heat sink is also designed to be highly efficient—it is capable of dissipating up to 100 Watts of heat, with a thermal resistance of up to 0.04 °C/W.
In addition, the ATS-10E-77-C3-R0 is designed to be easy to install and use. Its design allows for easy mounting onto most common components and devices, making it a convenient solution for a variety of industrial and consumer applications.
Conclusion
The ATS-10E-77-C3-R0 heat sink is a versatile thermal solution suitable for a variety of industrial, telecommunications, automotive, and consumer applications. It is designed to dissipate heat evenly, ensure optimal contact between the component and the heat sink, and optimize its thermal performance up to 100 Watts of heat, with a thermal resistance of up to 0.04 °C/W. The ATS-10E-77-C3-R0 is an ideal solution for controlling and managing the heat generated by other components or devices in a circuit or system.
The specific data is subject to PDF, and the above content is for reference