ATS-10E-78-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:ATS-10E-78-C3-R0 is a series of thermal management products that provides superior thermal control and cooling capability in various applications. The series consists of two primary components, the thermal heatsink and the high-efficiency heat exchanger, which can be combined to create a complete thermal solution for diverse applications. The ATS-10E-78-C3-R0 series offers an advanced level of thermal performance and control that can help organizations maximize the efficiency and lifespan of their electronic components. This article provides an overview of the ATS-10E-78-C3-R0 application field and working principle.Application Field:The ATS-10E-78-C3-R0 series is designed for use in many different types of electronic and computing applications. These include fields that are highly dependent on efficient heat management, such as medical, automotive, industrial, and communications applications. This is because the high-efficiency heat exchanger in the series can help transfer more heat away from components more efficiently than traditional thermal solutions. The ATS-10E-78-C3-R0 is also used in computers, network equipment, and gaming consoles, which require high-performance cooling to maintain peak performance.Working Principle:The ATS-10E-78-C3-R0 series uses a combination of thermal conduction and a high-efficiency heat exchanger to provide efficient heat transfer. This combination ensures that the heat generated within an electronic device is effectively transferred away from that device and  dissipated to the atmosphere. The heat exchanger is designed to maximize the thermal conductivity between the component and the heatsink. Heat is efficiently transferred from the component to the heatsink and then to the ambient air. The heat exchanger\'s specialized design provides superior thermal conduction that is more efficient than traditional heat sinks.The heatsink has large fins that provide a large surface area that dissipates maximum heat away from the component. This ensures that components can run at their desired temperature levels and can be done for extended periods of time without requiring excessive cooling. The heatsink also includes a low-noise fan to provide additional cooling to both the component and the heat exchanger. Conclusion:The ATS-10E-78-C3-R0 series is an advanced heat management solution that provides an efficient solution for a variety of applications. It features a combination of a high-efficiency heat exchanger and a thermal heatsink that can be used to efficiently transfer and dissipate heat away from components. The ATS-10E-78-C3-R0 series is ideal for organizations that require superior thermal performance and cooling capability in their electronics and computing applications.

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