| Allicdata Part #: | ATS-10E-88-C3-R0-ND |
| Manufacturer Part#: |
ATS-10E-88-C3-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10E-88-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.52800 |
| 30 +: | $ 3.33186 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10E-88-C3-R0 Application Field and Working Principle
Thermal-heat sinks are integral components in a wide range of electronic devices and gadgets, helping to preserve the wares from the destructive effects of overheating and accumulated heat. Without them, components of electronics may be damaged over extended periods of use, and would be at risk of being burned out.
The ATS-10E-88-C3-R0 heat sink is one of the leading models in this field. Designed to be used in numerous applications, it is a universal yet highly effective thermal solution.
Application Field
The ATS-10E-88-C3-R0 heat sink is ideal for use in devices with high heat generation levels. Examples include, but are not limited to, CPUs, amplifiers, power supplies, etc.
It is also quite suited for use in industrial and household appliances. Examples of such applications include ceiling fans, television sets, and air conditioning units. Heat sinks of this type are capable of improving the performance of these devices, while helping to minimize the risks of overheating and prolonging the life-cycles of the components.
Working Principle
Heat sinks use thermal energy to transfer heat away from the parts of electronic devices that are generating the most heat. This is done through the process of convection. When heat is generated by the component, thermal heating fins on the heat sink transfer heat away from the component. At the same time, a fan connected to the heat sink dissipates the heat from the fins into the surrounding air, thus keeping the component cool.
Moreover, heat sinks often use multiple cooling techniques, such as air cooling and liquid cooling. Air cooling is based on the process of dissipating heat away using large fan-like structures, whereas liquid cooling works on the principle of using liquid mediums such as water or oil to absorb and disperse heat away from the component.
The ATS-10E-88-C3-R0 is designed for continual air cooling operations. Its fins are deep enough to conduct heat away from the components proficiently, while its fan is also designed to guarantee continuous cooling. This heat sink is also lightweight and easy to install, making it a preferred choice for many devices.
Conclusion
The ATS-10E-88-C3-R0 heat sink is a reliable and high-effective solution for managing thermal conditions in electronic devices. Its design is universal, making it ideal for a variety of applications, ranging from industrial to household electronics. Moreover, it can be employed using either air cooling or liquid cooling techniques. It is lightweight, durable, and easy to install, thus making it an ideal solution for cooling problems.
The specific data is subject to PDF, and the above content is for reference