ATS-10E-89-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10E-89-C1-R0-ND

Manufacturer Part#:

ATS-10E-89-C1-R0

Price: $ 3.86
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X30MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10E-89-C1-R0 datasheetATS-10E-89-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.50469
30 +: $ 3.31002
50 +: $ 3.11535
100 +: $ 2.92062
250 +: $ 2.72591
500 +: $ 2.53120
1000 +: $ 2.48253
Stock 1000Can Ship Immediately
$ 3.86
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.91°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal - Heat Sinks encompass a wide range of applications and technologies, from small air-cooled heat sinks to large water-cooled cooling systems. The ATS-10E-89-C1-R0 is a specialized form of heat sink designed to meet the challenges of extreme operating temperatures and conditions in a range of industrial and consumer applications.

The ATS-10E-89-C1-R0 heat sink is an extreme-duty unit designed for operations at temperatures up to 89°C in harsh environments. It is constructed from anodized aluminum and includes optimized heat-dissipation fins. The installation package also includes mounting hardware such as screws, nuts, and washers.

The overall design of the ATS-10E-89-C1-R0 heat sink is intended to increase system reliability and lifetime. It achieves this by providing superior thermal performance to its competitors. The ATS-10E-89-C1-R0 is designed to provide excellent heat transfer from the heat sources, thus reducing the required input power, lower the temperature of the system environment, and reduce strain on the components.

The ATS-10E-89-C1-R0 is also equipped with a series of small fins on the top side, which enhance heat dissipation to reduce the impact of fan noise. Additionally, the advanced design of the heat-dissipation fins enables superior air circulation to further increase thermal efficiency. Together, these features result in an effective heat dissipation rate that can be up to 20% more efficient than other similar products.

The ATS-10E-89-C1-R0 is specifically designed to work with the EN60947-3 industrial standards for high temperature environments. This particular heat sink combines several different technologies for effective heat transfer. The main components of the heat sink are the heat-dissipation fins, the fan impeller, the motor, and the heat sensor.

The heat-dissipation fins are designed to rapidly dissipate heat away from the motor and fan impeller. The specialized fins provide a large surface area, which allows for efficient convection transfer of heat away from the components. The heat sensor is designed to detect and regulate the temperature of the entire system, while the fan impeller forces air to quickly cool the heat-dissipation fins.

The ATS-10E-89-C1-R0 heat sink is suitable for a wide range of industrial and consumer applications. It can be used in computers, telecommunications equipment, medical equipment, and military equipment that require superior thermal performance. Its rugged construction and robust design makes it ideal for operation in hostile environments and harsh climates. It is suitable for use in automotive, aerospace, semiconductor, and consumer applications. Its temperature rating of 89°C enables it to operate in the most extreme conditions, while its superior heat dissipation capabilities ensure optimal cooling performance for the most demanding applications.

The specific data is subject to PDF, and the above content is for reference

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