ATS-10E-93-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-10E-93-C2-R0 is an off-the-shelf thermal heat sink designed for thermal management applications that require both high performance and low power consumption. Its design features a unique combination of anodized aluminum fins with an internal polymer-sealed heat-pipe to maximize heat dissipation. The internally-sealed heat-pipe removes the need for additional external fans or air flow sources, allowing for maximum cooling performance within a given space constraint. This feature has enabled the ATS-10E-93-C2-R0 to be used in a wide range of devices and applications, including mobile and embedded computing, telecommunications, and military and industrial systems.

Application Field

ATS-10E-93-C2-R0 is widely used in various devices and applications that require efficient heat removal. Due to its compact design and high performance, it is suitable for a variety of thermal management applications, including computers, laptops, embedded and military applications, and even consumer electronics. For these types of applications, the ATS-10E-93-C2-R0 is typically installed directly onto the device’s thermal management chip—usually on top of the processor’s integrated heat-spreader—to provide optimal thermal transfer performance.Due to its low power consumption and efficient thermal conductivity, the ATS-10E-93-C2-R0 can also be used in a variety of consumer electronics products, such as TV boxes, game consoles, and streaming devices. In addition, this thermal heat sink can also be used in larger industrial or commercial applications, such as telecommunications systems and medical equipment.

Working Principle

The ATS-10E-93-C2-R0 thermal heat sink functions by dissipating heat away from its source, namely, a processor and integrated heat-spreader, through its uniquely-designed combination of anodized aluminum fins and internal polymer-sealed heat-pipe.The interior of the anodized aluminum fins is filled with specialized liquid, which absorbs heat from the heat source. As the liquid passes through the fins, it evaporates, cooling the surrounding heat-pipe and transferring heat away from the processor. When the liquid evaporates, it moves to a condenser at the top of the ATS-10E-93-C2-R0, where it condenses back into a liquid state and is then returned to the bottom of the fins, restarting the cycle.This efficient cycle of heat removal transfers the heat away from the processor or other source and out of the device, protecting it from thermal-related damage. Additionally, the internal polymer-sealed heat-pipe further improves efficiency by eliminating the need for additional external fans or air flow sources, allowing for maximum cooling performance within a given space constraint.

Conclusion

In conclusion, the ATS-10E-93-C2-R0 is a highly effective thermal heat sink designed for a wide range of thermal management applications. Its unique design features a combination of anodized aluminum fins and an internal polymer-sealed heat-pipe to maximize heat dissipation and minimize power consumption. This heat sink is ideal for applications that require efficiency, such as mobile and embedded computing, telecommunications, and military and industrial systems. Additionally, it is also ideal for consumer electronics products, such as TV boxes, game consoles, and streaming devices.

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