ATS-10F-02-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10F-02-C3-R0-ND

Manufacturer Part#:

ATS-10F-02-C3-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10F-02-C3-R0 datasheetATS-10F-02-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks have many applications in industries. Perhaps the most common use is in the cooling of electronic devices, such as semiconductors and other components. The ATS-10F-02-C3-R0 is a Heat Sink model that has become increasingly popular in this field due to its versatile design. This article will explore the various aspects of the ATS-10F-02-C3-R0, including its application field and working principle.

The ATS-10F-02-C3-R0 is a highly efficient heat sink designed for use with all types of thermal management applications. Its design consists of a cold plate made of copper, which is connected to a large aluminum base. The aluminum base has a series of fins arranged in a row to provide maximum surface area for heat dissipation. This design ensures that the heat generated by the electronic device is quickly dissipated away from the device.

The ATS-10F-02-C3-R0 is most commonly used in the cooling of high-powered electronic devices such as computers and servers. This is due to its efficient design and its ability to quickly dissipate heat. The fins on the aluminum base provide a large heat dissipating surface area, which allows the heat to be quickly dissipated away from the device. Additionally, the copper cold plate absorbs the heat and transfers it to the aluminum base faster than other materials.

The ATS-10F-02-C3-R0 can also be used to cool industrial machinery such as welding or soldering equipment. The aluminum base and large fins provide a large surface area that can effectively dissipate the heat generated by the equipment. Additionally, the copper cold plate helps to absorb the heat and transfer it away from the device or equipment quickly.

In addition to its efficient design, the ATS-10F-02-C3-R0 also has a relatively low purchase price. This makes it an ideal choice for those looking for an effective heat sink model that is both affordable and efficient. In addition, the ATS-10F-02-C3-R0 has a long lifespan, making it a reliable and cost-effective option.

Lastly, it is important to understand the working principle of the ATS-10F-02-C3-R0. The working principle of the ATS-10F-02-C3-R0 is based on the principles of thermal transfer. As the device or equipment operates, it generates heat, which is then transferred to the aluminum base of the ATS-10F-02-C3-R0. As the aluminum base absorbs and dissipates the heat, the cold plate absorbs and transfers the heat away from the device or equipment.

In conclusion, the ATS-10F-02-C3-R0 is an effective and affordable heat sink model with a variety of applications in the cooling of electronic devices and industrial machinery. Its efficient design enables it to quickly dissipate heat away from the device, while its low purchase price ensures a reliable option for those looking for cost-effective solutions. Additionally, its working principle is based on the principles of thermal transfer, which ensures a powerful method of cooling and dissipating heat away from the device or equipment.

The specific data is subject to PDF, and the above content is for reference

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