ATS-10F-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10F-10-C1-R0-ND

Manufacturer Part#:

ATS-10F-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10F-10-C1-R0 datasheetATS-10F-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is important for successful operation of many mechanical systems. In some applications, it may be necessary to use a heat sink in order to help dissipate heat from the system. This is especially useful in applications where high temperatures are expected to be present. The ATS-10F-10-C1-R0 is a device that is designed for use as a heat sink. It is intended to replace or complement a traditional heat sink or fan.

The ATS-10F-10-C1-R0 is a thermal management system that is designed for use in a variety of applications. It is ideal for applications that require heat dissipation over a wide range of temperatures and for those where precise thermal management is needed. The ATS-10F-10-C1-R0 can be used to maintain optimal temperatures in a system, ensuring it operates reliably and efficiently.

To make use of the ATS-10F-10-C1-R0, it must be installed in the system, either replacing or complementing an existing heat sink. The device is installed by connecting it to the system\'s heat sink and power cables. Once connected, the ATS-10F-10-C1-R0 is able to function by transferring heat away from the system and dissipating it into the environment or by transferring it to a radiation source. This helps to maintain optimal temperatures and improve system performance.

The ATS-10F-10-C1-R0 is designed to be robust, durable and reliable, able to withstand a wide range of temperatures. Its high thermal conductivity means that heat will be transferred quickly away from the system and into the environment. Additionally, its high thermal capacity ensures that it can handle any excess heat that may build up during system operation.

The ATS-10F-10-C1-R0 can be used in a variety of applications including automotive, medical, industrial and military systems. It is suitable for both continuous and periodic operation and can be used in high stress, high vibration environments. Its broad temperature range and small size makes it an ideal choice for a wide variety of applications.

Overall, the ATS-10F-10-C1-R0 is an ideal choice for applications that require effective thermal management. Its robust design, reliable performance and wide temperature range make it suitable for a variety of applications. With its high thermal conductivity and capacity, it is capable of dissipating heat quickly and efficiently, helping to ensure system performance and reliability.

The specific data is subject to PDF, and the above content is for reference

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