ATS-10F-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10F-10-C3-R0-ND

Manufacturer Part#:

ATS-10F-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10F-10-C3-R0 datasheetATS-10F-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are a crucial part of any successful electronics design. Heat sinks are used to dissipate heat away from components, boards, assemblies and even entire systems. The ATS-10F-10-C3-R0 is a leading model of heat sink in today’s market and is most commonly used for high-density components in applications requiring increased reliability.

The ATS-10F-10-C3-R0 is typically used in numerous type of power supplies and DC-DC converters. The heat sink has a simple construction consisting of a base plate with a series of fins that extend from the PCB to disperse the heat. The fins are designed to maximize the surface area and increase the airflow which assists in dissipating the heat.

The ATS-10F-10-C3-R0 is equipped with an effective clip-on mounting system which provides an easy, efficient and cost-effective solution for mounting the heat sink to the PCB. The standard mounting clips are made of resilient steel and are designed to provide reliable and secure mounting while also resisting shock and vibration.

The ATS-10F-10-C3-R0 features an aluminum construction and Nickel finish for maximum heat dissipation. The inner surface of the fins is electroplated with Nickel for enhanced performance and enhanced corrosion resistance. The heat sink also features an open fluidix design which increases air-flow and reduces temperature height.

The ATS-10F-10-C3-R0 is also designed to be efficient and easy to install. The heat sink\'s lightweight and compact design means that it can be easily integrated into existing systems without requiring costly surgery or extensive modification. Additionally, the heat sink\'s unique clip-on mounting system allows for quick and easy installation with no need for additional hardware.

The ATS-10F-10-C3-R0 is a highly efficient heat sink with excellent thermal transfer capabilities. It has been proven to be an effective heat sink for thermal management of high-density components in applications requiring increased reliability. It can be easily installed and is a cost-effective solution for thermal management of a variety of power supplies and DC-DC converters. The ATS-10F-10-C3-R0 heat sink is an ideal solution for anyone looking for a reliable and efficient thermal solution for their applications.

The specific data is subject to PDF, and the above content is for reference

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